Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Syunsuke Kawai"'
Publikováno v:
International Symposium on Microelectronics. 2016:000638-000643
SnAg electroplating method is widely used in the formation of LF solder bump for flip chip connection. While electroplating is able to form void free solder bump in a suitable operating condition, void may occur suddenly when used in mass production.
Publikováno v:
ENVIRONMENTAL SYSTEMS RESEARCH. 32:287-296
Autor:
Akiyoshi Takagi, Syunsuke Kawai
Publikováno v:
INFRASTRUCTURE PLANNING REVIEW. 21:309-316
The future population is estimated to decrease by the low birthrate in and after 2006 in Japan. We have to consider the problem of the population decreasing and the delay time of the facility development and the natural purification when planning the
Autor:
Nobuaki Ema, Syunsuke Kawai, Takayoshi Tsuchiya, Motoaki Iwaya, Satoshi Kamiyama, Tetsuya Takeuchi, Isamu Akasaki, Daisuke Iida
Publikováno v:
Applied Physics Letters. 105:072101
We developed a laser lift-off technique for a freestanding GaN substrate using an In droplet formed by thermal decomposition of GaInN. A combination of an In droplet formed by thermal decomposition of GaInN during growth and a pulsed second-harmonic
Publikováno v:
ECS Meeting Abstracts. :445-445
not Available.
Autor:
Daisuke Iida, Syunsuke Kawai, Nobuaki Ema, Takayoshi Tsuchiya, Motoaki Iwaya, Tetsuya Takeuchi, Satoshi Kamiyama, Isamu Akasaki
Publikováno v:
Applied Physics Letters; 8/18/2014, Vol. 105 Issue 7, p1-4, 4p, 2 Diagrams, 4 Graphs