Zobrazeno 1 - 10
of 46
pro vyhledávání: '"Syun Ming Jang"'
Autor:
Peng-Soon Lim, Liang-Gi Yao, Syun-Ming Jang, Y. Jin, Vincent S. Chang, S.-C. Chen, H.J. Tao, Fong-Yu Yen, Yong-Tian Hou, Mong-Song Liang, H.J. Lin, Chi Chun Chen, Peng-Fu Hsu, C.L. Hung, Jian-Yong Jiang
Publikováno v:
ECS Transactions. 1:113-123
A semi-empirical, stacked capacitor model was developed to calculate the dielectric constants (k) and deposition rates of hafnium silicate (HfSiO) deposited by nano-laminated atomic layer deposition (NL-ALD) from the HfO2 and SiO2 ALD cycles (m and n
Autor:
Lain-Jong Li, Chiu-Chih Chiang, Mao-Chieh Chen, Zhen-Cheng Wu, Syun-Ming Jang, Mong-Song Liang
Publikováno v:
Japanese Journal of Applied Physics. 43:7415-7418
In this work, we investigate the effects of oxygen (O2) and nitrogen (N2) plasma treatments on the copper surface of aluminum/amorphous silicon-nitricarbide/copper (Al/α-SiCN/Cu) metal–insulator–metal (MIM) capacitors with respect to their leaka
Publikováno v:
Thin Solid Films. 466:54-61
The properties and thermal stability of porous organic low-dielectric-constant films (version 8 and version 9) have been studied in this research. These porous films were obtained by spin coating, followed by baking and furnace curing. Both porous fi
Publikováno v:
Thin Solid Films. 460:167-174
The mechanical properties of porous low-dielectric-constant (low-k) thin films have been investigated for the stability evaluation of multilevel-interconnect structures using nanoindentation, microscratch, and four-point bending tests. Stress–strai
Publikováno v:
Japanese Journal of Applied Physics. 42:5246-5250
This work investigates the thermal stability and physical and barrier properties of two species of plasma-enhanced chemical-vapor-deposited (PECVD) amorphous silicon–nitrocarbide (α-SiCN:H) films with different hydrogen contents and dielectric con
Autor:
Chung-Chi Ko, Chiu-Chih Chiang, Mao-Chieh Chen, Mong-Song Liang, Zhen-Cheng Wu, Syun-Ming Jang
Publikováno v:
Japanese Journal of Applied Physics. 42:4273-4277
This work investigates the thermal stability and physical and barrier properties of two species of plasma-enhanced chemical vapor deposited (PECVD) α-SiC:H silicon carbide films (with k-values less than 5) deposited using trimethylsilane, (CH3)3SiH
Autor:
Mao-Chieh Chen, Chen-Hua Yu, Hsi-Ping Chen, Mong-Song Liang, Syun-Ming Jang, Chiu-Chih Chiang, Zhen-Cheng Wu, Wei-Hao Wu, Chung-Chi Ko
Publikováno v:
Japanese Journal of Applied Physics. 42:4489-4494
In this work, we investigate the thermal stability and physical and barrier properties of three species of plasma enhanced chemical vapor deposition (PECVD) α-SiC:N:H silicon carbide films with different carbon and nitrogen contents and dielectric c
Characterization and modeling of edge direct tunneling (EDT) leakage in ultrathin gate oxide MOSFETs
Autor:
Kuo-Nan Yang, Yeou-Ming Lin, Syun-Ming Jang, Mo-Chiun Yu, Mong-Song Liang, Douglas Yu, Hsin-Hui Huang, Ming-Jer Chen
Publikováno v:
IEEE Transactions on Electron Devices. 48:1159-1164
This paper examines the edge direct tunneling (EDT) of electron from n/sup +/ polysilicon to underlying n-type drain extension in off-state n-channel MOSFETs having ultrathin gate oxide thicknesses (1.4-2.4 nm). It is found that for thinner oxide thi
Autor:
Tuo-Hong Hou, Shyh-Fann Ting, Shih-Chang Chen, Mong-Song Liang, Ming-Fang Wang, Mo-Chiun Yu, Yean-Kuen Fang, Chein-Hao Chen, Syun-Ming Jang, Douglas Yu, Yong-Shiuan Tsair, Chih-Wei Yang
Publikováno v:
IEEE Transactions on Electron Devices. 48:2769-2776
The electrical properties affected by the bottom oxide materials and the post-deposition treatment on the ultrathin (down to 1.6 nm) nitride/oxide (N/O) stacks, prepared by rapid thermal chemical vapor deposition (RTCVD) with two-step NH/sub 3//N/sub
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 18:2986-2991
In this article, we adopted the rapid thermal oxidation (RTO) method to grow gate oxide layers on Si substrates. These RTO oxides were grown in both O2 atmosphere (dry RTO oxide) and in H2 and O2 mixed atmosphere (wet RTO oxide) at above 1000 °C. Fo