Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Sylvain Ouimet"'
Autor:
M.-C. Paquet, Sylvain Ouimet
Publikováno v:
IEEE Transactions on Advanced Packaging. 22:123-128
The transfer molding technology is normally used for leadframe type packages and chip-up plastic ball grid array (PBGA) packages. This technology has been applied to cavity down PBGA packages where, normally, a liquid epoxy is dispensed by a needle i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a4ccb5f3ca7d79f38a1425535555dbff
https://doi.org/10.1109/6040.763182
https://doi.org/10.1109/6040.763182
Autor:
Karen P. McLaughlin, David Turnbull, Chris Muzzy, Naftali E. Lustig, Danielle Degraw, Richard Bisson, Jason Gill, John P. Cincotta, Sylvain Ouimet, Joseph C. Ross, Edward Engbrecht
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
A review of the chip-to-package interaction (CPI) results during the development and qualification of IBM's 22SOI high performance technology will be presented. Initial results and failure modes using ultra low-k (ULK) dielectric BEOL during the earl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10cec1ca7fd3f2013eaba1c8d3e9401b
https://doi.org/10.1109/ectc.2013.6575602
https://doi.org/10.1109/ectc.2013.6575602
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
The following details a new test methodology offered as a cost effective alternative to module form-factor testing for detecting the delamination fail mode observed in Multiterminal low inductance capacitors (MTLICs) under temperature humidity bias (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f750db9ed92bc321939d887f1dc192ba
https://doi.org/10.1109/ectc.2010.5490651
https://doi.org/10.1109/ectc.2010.5490651
Publikováno v:
2009 59th Electronic Components and Technology Conference.
The Flip Chip Plastic Ball Grid Array (FCPBGA) has become the prevalent packaging solution for mainstream microprocessors and high performance Asics. Increases in device size for these applications have begun to push the limits in terms of bond and a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::612ac9592813afe132a28226a936e014
https://doi.org/10.1109/ectc.2009.5074093
https://doi.org/10.1109/ectc.2009.5074093
Autor:
Jennifer V. Muncy, Jeffrey Thomas Coffin, Michael C. Triplett, Joseph C. Ross, Charles L. Arvin, Wolfgang Sauter, Sylvain Ouimet
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Multi-terminal low inductance capacitors (MTLICs) are used widely throughout the electronics industry to aid with voltage noise suppression and to manage high speed switching currents. They are implemented on system level cards as well as microproces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46056b2036bb9e9a7093bf6d4521ab2e
https://doi.org/10.1109/ectc.2009.5074173
https://doi.org/10.1109/ectc.2009.5074173
Autor:
Jennifer V. Muncy, Isabelle Depatie, Virendra R. Jadhav, Thomas A. Wassick, Jon A. Casey, Kenneth C. Marston, Sylvain Ouimet, John S. Corbin
Publikováno v:
2008 58th Electronic Components and Technology Conference.
For many years, the Flip Chip Plastic Ball Grid Array (FC-PBGA) has been the preferred packaging solution for microprocessors and high performance ASICs. IBM has developed a dual chip Flip Chip Plastic Land Grid Array (FC- PLGA) package to support lo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47071b8d05dad2bfe581299ddd517ca5
https://doi.org/10.1109/ectc.2008.4550241
https://doi.org/10.1109/ectc.2008.4550241
Publikováno v:
2008 58th Electronic Components and Technology Conference.
Component manufacturers and card assemblers are regularly confronted by the specification limits for the coplanarity of electronic components, and the effects of component warp age over the temperature range encountered during reflow processes used d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afcdb777f437dbe4113f62cefe6b7024
https://doi.org/10.1109/ectc.2008.4550002
https://doi.org/10.1109/ectc.2008.4550002
Autor:
Valerie Oberson, Marie-Claude Paquet, Eric Duchesne, Marco Gauvin, Stephane Barbeau, Julien Sylvestre, Sylvain Ouimet, H. Lavoie
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
The migration to lead free connections in the microelectronic industry has brought forth many technical challenges, especially in the packaging technology area with respect to materials and processes. The two major drivers to these challenges are the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee284decb9d859399b0735376a5908ad
https://doi.org/10.1109/ectc.2007.373968
https://doi.org/10.1109/ectc.2007.373968
Autor:
Peter Hong Xiao, Petar Pepeljugoski, John D. Crow, Jeannine M. Trewhella, Dianne L. Lacey, T.L. Smith, S. Tremblay, W. Nation, S.A. Igl, Stephen Louis Spanoudis, A.J. Piekarczyk, Glen Walden Johnson, B.A. DeBaun, Joong-ho Choi, Marco Gauvin, Sylvain Ouimet, S. Ponnapalli, D. Booth, M.S. Cohen, K. Stawiasz, A.S. Kuczma, G.D. Henson, D.M. Kuchta, N.A. Lee, A. Lacerte
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
The Jitney Parallel Optical Interconnect consists of a transmitter module, a receiver module, and a cable capable of sending 1 GigaByte/sec over 1-100 meter spans. This technology has been developed to be cost competitive with copper bus technology,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57787b5d6627e9e426e195e58f00c6fa
https://doi.org/10.1109/ectc.1996.517405
https://doi.org/10.1109/ectc.1996.517405
Autor:
Stephen Louis Spanoudis, Sylvain Ouimet, D.M. Kuchta, M.S. Cohen, Glen Walden Johnson, J.W. Trewhella, Petar Pepeljugoski
Publikováno v:
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
The Jitney parallel optical interconnect is a prototype 20-channel wide, low cost data link, designed for operation at speeds up to one Gbyte/s over distances approaching 100 meters. The package is based on (1) an inexpensive overmolded leadframe, (2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::25b59f1c88f70e2a617101a8a06c5c3e
https://doi.org/10.1109/ectc.1998.678877
https://doi.org/10.1109/ectc.1998.678877