Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Swaroop Kommera"'
Autor:
Mary Tang, Swaroop Kommera, Usha Raghuram, Michelle Rincon, Xiaoqing Xu, Jonathan Fan, Roger T. Howe
Publikováno v:
Journal of the Society for Information Display. 31:86-94
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3e44a5b79c28d961bda10d143bc514c
https://doi.org/10.1002/jsid.1182
https://doi.org/10.1002/jsid.1182
Publikováno v:
53rd Electronic Components and Technology Conference, 2003. Proceedings..
Novel high-density through-die connections from the front to the back of a silicon die are described. Single-diameter front-to-back through-die connections have previously been explored for various applications. The authors have explored a two-level
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::633f751d4fb2def81e8b8fc2bb51730d
https://doi.org/10.1109/ectc.2003.1216345
https://doi.org/10.1109/ectc.2003.1216345
Publikováno v:
SPIE Proceedings.
Novel through-die front-to-back connections for MEMS applications are described. Large diameter (~100 μm diameter) front-to-back through-die connections have been studied previously for MEMS applications. Multi-level through-die hole structures are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d4f146e25f65b25cc707445e9a7a9cd
https://doi.org/10.1117/12.472804
https://doi.org/10.1117/12.472804