Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Swarbrick Ian A"'
Publikováno v:
Dans Design, Automation and Test in Europe - DATE'05, Munich : Allemagne (2005)
As Moore's Law continues to fuel the ability to build ever increasingly complex system-on-chips (SoCs), achieving performance goals is rising as a critical challenge to completing designs. In particular, the system interconnect must efficiently servi
Externí odkaz:
http://arxiv.org/abs/0710.4681
Autor:
Jeff Cuppett, Ygal Arbel, Brian C. Gaide, Dinesh D. Gaitonde, Abbas Morshed, Bala Jayadev, Swarbrick Ian A, Sagheer Ahmad
Publikováno v:
Hot Interconnects
Xilinx Versal Adaptable Compute Acceleration Platform (ACAP) is a new software-programmable heterogenous compute platform. The slowing of Moores law and the everpresent need for higher levels of compute performance has spurred the development of many
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::135cec2b5e231175a5e34078080ca7d2
https://doi.org/10.1109/hoti.2019.00016
https://doi.org/10.1109/hoti.2019.00016
Publikováno v:
FPGA
This paper outlines the Network-on-Chip (NoC) on Xilinx's next generation Versal-architecture. It is a hardened NoC that is present in Xilinx's next-generation 7nm architecture devices. These devices include many other new hardened features that make
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7bc08ee0d1f95b9ecc53b778f8dce396
https://doi.org/10.1145/3289602.3293908
https://doi.org/10.1145/3289602.3293908
Autor:
Swarbrick, Ian Andrew
Throughput and latency are critical parameters in multiprocessor interconnection networks. These parameters are governed by the combination of routing node and interconnect performance. Recent years have seen several new interconnect technologies rea
Externí odkaz:
https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.484255
Autor:
Swarbrick, Ian Andrew.
Throughput and latency are critical parameters in multiprocessor interconnection networks. These parameters are governed by the combination of routing node and interconnect performance. Recent years have seen several new interconnect technologies rea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______305::7a8c8b6a59bef14c50fe8c89c83a60aa
https://surrey.eprints-hosting.org/844480/
https://surrey.eprints-hosting.org/844480/
Publikováno v:
Proceedings of the Conference: Design, Automation & Test in Europe; 3/7/2005, Vol. 1, p1232-1237, 6p