Zobrazeno 1 - 10
of 51
pro vyhledávání: '"Sven Kluska"'
Autor:
Armin Richter, Sven Kluska, Stefan W. Glunz, Victoria Davis, Anna Fischer, Jonas Bartsch, Markus Glatthaar, Thibaud Hatt
Publikováno v:
ACS Applied Materials & Interfaces. 13:5803-5813
A resist-free metallization of copper-plated contacts is attractive to replace screen-printed silver contacts and is demonstrated on large-area silicon heterojunction (SHJ) solar cells. In our approach, a self-passivated Al layer is used as a mask du
Autor:
Benjamin Grübel, Sven Kluska, Gisela Cimiotti, Christian Schmiga, Varun Arya, Bernd Steinhauser, Baljeet Singh Goraya, Sebastian Nold, Martin Hermle, Mathias Kamp, Michael Passig, Markus Sieber, Damian Brunner
Publikováno v:
SiliconPV 2021, The 11th International Conference on Crystalline Silicon Photovoltaics.
Autor:
Radwa Elgazzar, Ulrike Heitmann, Leonie Jakob, Benedikt Bläsi, Oliver Höhn, Sven Kluska, Jonas Bartsch
Publikováno v:
SiliconPV 2021, The 11th International Conference on Crystalline Silicon Photovoltaics.
Publikováno v:
IEEE Journal of Photovoltaics. 10:1455-1462
Plating is an emergent cost-effective metallization technology for depositing solar cell metal contacts. Plated contacts, however, typically plate in-homogeneously where fingers plate higher than busbars and solar cell edges plate particularly higher
Publikováno v:
IEEE Journal of Photovoltaics. 10:444-448
In this article, the impact of postplating annealing on the regenerated state of boron-doped p-type passivated emitter and rear cell (PERC) solar cells with plated Ni/Cu/Ag front-side contacts is characterized. The assessment of different plating ann
Publikováno v:
Silicon Solar Cell Metallization and Module Technology ISBN: 9781839531552
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0dd2c290a62630b66bf22fc1053b8b0
https://doi.org/10.1049/pbpo174e_ch8
https://doi.org/10.1049/pbpo174e_ch8
Autor:
Thibaud, Hatt, Jonas, Bartsch, Victoria, Davis, Armin, Richter, Sven, Kluska, Stefan W, Glunz, Markus, Glatthaar, Anna, Fischer
Publikováno v:
ACS applied materialsinterfaces. 13(4)
A resist-free metallization of copper-plated contacts is attractive to replace screen-printed silver contacts and is demonstrated on large-area silicon heterojunction (SHJ) solar cells. In our approach, a self-passivated Al layer is used as a mask du
Autor:
Gisela Cimiotti, Bernd Steinhauser, Sven Kluska, Benjamin Grubel, Damian Brunner, M. Passig, Markus Glatthaar, Christian Schmiga, Varun Arya, N. Bay
The metallization of bifacial tunneling oxide and passivating contacts (TOPCon) solar cells without initial metal seed layer by electroplating of Ni/Cu/Ag is demonstrated. The presented approach allows a lead-free metallization with narrow contact ge
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fbc8056398a7b28f3a2c8fa6f986f9d3
https://publica.fraunhofer.de/handle/publica/267663
https://publica.fraunhofer.de/handle/publica/267663
Autor:
Sven Kluska, Stefan Janz, Jana Wulf, Ulrike Heitmann, Nima Huschmand, Frank Dimroth, Jonas Bartsch, David Lackner
On the route to a high efficiency glued tandem solar cell fabricated using a ZnO-based transparent conductive adhesive, several challenges were encountered. By lowering the pressure during the annealing of the adhesive to 0.3 or 1 kg/cm2, the III-V s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::78bdd2993bb6a95ca5d2e56f9e4b0382
Autor:
Gisela Cimiotti, Heinrich Berg, Benjamin Grubel, Sven Kluska, Irene Kubitza, Christian Schmiga, A.J. Beinert, Paul Müller, Torsten Voss
Publikováno v:
EPJ Photovoltaics, Vol 12, p 10 (2021)
This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs