Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Sven Brinkhues"'
Autor:
Sanchit Rathi, Michael Brosch, Markus Detert, Martin Deckert, Shambhavi M Shukla, Bertram Schmidt, Sven Brinkhues
Publikováno v:
2019 IEEE 16th India Council International Conference (INDICON).
The aim of this work is to test and evaluate Poly -(3,4-ethylenedioxythiophene) – poly (styrenesulfonate), simply known by the abbreviation PEDOT:PSS as a possible low cost and transparent electrically conducting polymer for the fabrication of magn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4421c6ae0c28ecb37e24f9026cec3376
https://doi.org/10.1109/indicon47234.2019.9030320
https://doi.org/10.1109/indicon47234.2019.9030320
Autor:
Sören Majcherek, Alexander Aman, Sven Brinkhues, Akhil Kanthamneni, Bertram Schmidt, A. Brose
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:1703-1710
Functional prototyping during development of new molded interconnect device (MID) products offers benefits such as evaluation of design specifications, validation of manufacturing technologies, and functional testing of the entire product. Introducti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88135ba784fa706a464d0867bba2c50a
https://doi.org/10.1109/tcpmt.2016.2617080
https://doi.org/10.1109/tcpmt.2016.2617080
Publikováno v:
2016 12th International Congress Molded Interconnect Devices (MID).
One essential reliability criteria for Laser Direct Structured Molded Interconnect Devices is the adhesion between substrate and metallization. Low adhesion values are indicative of premature failure of the metallization and are often due to inadequa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f5859b6098dc316c807922f2ab913b0
https://doi.org/10.1109/icmid.2016.7738935
https://doi.org/10.1109/icmid.2016.7738935
Publikováno v:
2016 39th International Spring Seminar on Electronics Technology (ISSE).
The focus of this work was the development of additive metal deposition techniques on Polydimethylsiloxane based foils. The metallic films provide electrical interconnection to commercial available surface-mount devices. Therefor two maskless techniq
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7b2be3a76515a529e43af28d57832e6
https://doi.org/10.1109/isse.2016.7563164
https://doi.org/10.1109/isse.2016.7563164