Zobrazeno 1 - 10
of 507
pro vyhledávání: '"Suresh V. Garimella"'
Publikováno v:
ACS Omega, Vol 4, Iss 27, Pp 22385-22391 (2019)
Externí odkaz:
https://doaj.org/article/398e83d81ce54663afeea37fb4f2a53d
Publikováno v:
ACS Omega, Vol 2, Iss 6, Pp 2883-2890 (2017)
Externí odkaz:
https://doaj.org/article/1fb018b9dd0e4ae9bef2fd8c6d9e20f3
Publikováno v:
CTRC Research Publications
Enhancement of the rate of boiling heat transfer, a critically significant need across a range of industrial transport processes, can be achieved by the introduction of surface microstructures. However, the precise mechanism of such enhancement is no
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7ee1b13ad477e6f505a31a9eb62f5afd
https://docs.lib.purdue.edu/cgi/viewcontent.cgi?article=1395&context=coolingpubs
https://docs.lib.purdue.edu/cgi/viewcontent.cgi?article=1395&context=coolingpubs
Publikováno v:
International Journal of Refrigeration.
Publikováno v:
International Journal of Refrigeration.
Autor:
Michael M. Ohadi, Raphael Mandel, Mehdi Asheghi, Catherine Gorle, Suresh V. Garimella, Mark D. Schultz, Justin A. Weibel, Pritish R. Parida, Joel L. Plawsky, Timothy J. Chainer, James W. Palko, Kenneth E. Goodson, Joseph J. Maurer, Avram Bar-Cohen, Yoav Peles, Yogendra Joshi
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1546-1564
The Intrachip Enhanced Cooling Fundamentals (ICECool Fun) effort was launched by the Defense Advanced Research Projects Agency (DARPA) under the leadership of Dr. Avram Bar-Cohen during 2012–2015 to target an order of magnitude improvement in chip
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1634-1644
Flow boiling in microchannel heat sinks is capable of providing the high-heat-flux dissipation required for thermal management of next-generation wide bandgap power electronics at low pumping power and uniform surface temperatures. One of the primary
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1615-1624
Flow boiling provides an effective means of heat removal but can suffer from thermal and hydrodynamic transients that compromise heat transfer performance and trigger device failure. In this study, the transient flow boiling characteristics in two th
Publikováno v:
International Journal of Heat and Mass Transfer. 204:123875
Publikováno v:
International Journal of Multiphase Flow. 161:104380