Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Suresh Jayaraman"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000751-000773
Fan-Out Wafer Level Packaging (FOWLP) holds immediate promise for packaging semiconductor chips with higher interconnect density than the incumbent Wafer Level Chip Scale Packaging (WLCSP). FOWLP enables size and performance capabilities similar to W
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ee3f6de0ccf9664f4d98deae177bc4b
https://doi.org/10.4071/2016dpc-tp22
https://doi.org/10.4071/2016dpc-tp22
Autor:
InSu Mok, Curtis Zwenger, Moh Kolbehdari, IlBok Lee, Alex Copia, WonChul Do, Kang-Wook Lee, Wongeol Lee, Suresh Jayaraman, WonMyoung Ki
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Fan-out wafer level packaging (FOWLP) is one of the latest technologies to meet the requirements of high performance and thin form-factor, especially for mobile application processors. To achieve a simple path way and thinner package form, many outso
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ba204afcca55ef029be9dab43a68c11
https://doi.org/10.1109/ectc.2018.00092
https://doi.org/10.1109/ectc.2018.00092
Autor:
Rahul Goyal, Suresh Jayaraman, Sudipto Mukherjee, Anoop Chawla, Dhaval Jani, Nataraju Vusirikala
Publikováno v:
Traffic injury prevention. 13(6)
Human body finite element models (FE-HBMs) are available in standard occupant or pedestrian postures. There is a need to have FE-HBMs in the same posture as a crash victim or to be configured in varying postures. Developing FE models for all possible
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::92fd729a2473a597f950d92251cf0445
https://pubmed.ncbi.nlm.nih.gov/23137095
https://pubmed.ncbi.nlm.nih.gov/23137095