Výsledky vyhledávání - "Suresh Jayaraman"

M-Series with Adaptive Patterning for High-Yield Fan-Out SIP

Autor: Christopher M. Scanlan, Boyd Rogers, Craig V. Bishop, Suresh Jayaraman, Timothy L. Olson

Publikováno v: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000751-000773

Fan-Out Wafer Level Packaging (FOWLP) holds immediate promise for packaging semiconductor chips with higher interconnect density than the incumbent Wafer Level Chip Scale Packaging (WLCSP). FOWLP enables size and performance capabilities similar to W

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2ee3f6de0ccf9664f4d98deae177bc4b
https://doi.org/10.4071/2016dpc-tp22

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Chip Stackable, Ultra-thin, High-Flexibility 3D FOWLP (3D SWIFT® Technology) for Hetero-Integrated Advanced 3D WL-SiP

Autor: InSu Mok, Curtis Zwenger, Moh Kolbehdari, IlBok Lee, Alex Copia, WonChul Do, Kang-Wook Lee, Wongeol Lee, Suresh Jayaraman, WonMyoung Ki

Publikováno v: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Fan-out wafer level packaging (FOWLP) is one of the latest technologies to meet the requirements of high performance and thin form-factor, especially for mobile application processors. To achieve a simple path way and thinner package form, many outso

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::9ba204afcca55ef029be9dab43a68c11
https://doi.org/10.1109/ectc.2018.00092

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Arvind Fashions informs about outcome of AGM.

Publikováno v: Ace Analyser: Company News. 9/12/2023, pN.PAG-N.PAG. 1p.

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Repositioning the knee joint in human body FE models using a graphics-based technique

Autor: Rahul Goyal, Suresh Jayaraman, Sudipto Mukherjee, Anoop Chawla, Dhaval Jani, Nataraju Vusirikala

Publikováno v: Traffic injury prevention. 13(6)

Human body finite element models (FE-HBMs) are available in standard occupant or pedestrian postures. There is a need to have FE-HBMs in the same posture as a crash victim or to be configured in varying postures. Developing FE models for all possible

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::92fd729a2473a597f950d92251cf0445
https://pubmed.ncbi.nlm.nih.gov/23137095

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