Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Surasit Chungpaiboonpatana"'
Autor:
Teck Wah Park, Siew Hoon Ore, Daniel Teh, Kian Yeow Gan, Nathapong Suthiwongsunthorn, Yong Bo Yang, Drake Koh, Michael Gantalao Ti In, Surasit Chungpaiboonpatana, Geraldine Ng, Boon Pek Liew, Jonathan Tamil
Publikováno v:
International Symposium on Microelectronics. 2011:000673-000682
Moldability is a crucial aspect of flip chip technology. It is an increasing challenge to ensure moldability with rapid advances in flip chip technology such as decreasing bump pitch and stand-off height, especially when commercial molded underfill (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::052c3a6a45e9698267f553f6b6dc4006
https://doi.org/10.4071/isom-2011-wp1-paper4
https://doi.org/10.4071/isom-2011-wp1-paper4
Autor:
Surasit Chungpaiboonpatana, Ming-Yuan Cheng, Ramona Damalerio, Kwan Ling Tan, Ruiqi Lim, Weiguo Chen
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
In this work, an assembled and integrated flexible probe array with biodegradable coating for stiffness control is demonstrated. The proposed method will help to overcome the stiffness issue faced by polymeric probe array during insertion into the br
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1005a66c18454fcfed55355825bda14
https://doi.org/10.1109/eptc.2015.7412287
https://doi.org/10.1109/eptc.2015.7412287
Autor:
Kian Yeow Gan, Jonathan Tamil, Surasit Chungpaiboonpatana, Siew Hoon Ore, Nathapong Suthiwongsunthorn
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
We have developed solutions for the quick assessment of the D2-FBGA thermal performance to meet the rising demands for shorter cycle times to provide thermal solutions. D2-FBGA package has multiple devices packaged within the same footprint which can
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::65b56ef5883793b862d3ebc3e431b27d
https://doi.org/10.1109/eptc.2011.6184512
https://doi.org/10.1109/eptc.2011.6184512
Autor:
Zheng Boyu, W.L. Yuan, Surasit Chungpaiboonpatana, Nathapong Suthiwongsunthorn, Chuen Khiang Wang
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
With the increasing function integration, there is constant demand for multiple-chip packages with faster data rate in smaller footprint, therefore, 3D package technologies have attracted more and more attentions. In this paper, three common 3D packa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48f3a0c8c5e1101263e7ac14950d0e3a
https://doi.org/10.1109/eptc.2010.5702617
https://doi.org/10.1109/eptc.2010.5702617
Publikováno v:
Proceedings International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces, 2005; 2005, p287-292, 6p
Publikováno v:
2004 Proceedings 9th International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces (IEEE Cat. No.04TH8742); 2004, piii-vi, 4p
Autor:
Tamil, Jonathan1 Jonathan_Tamil@sg.utacgroup.com, Siew Hoon Ore1, Kian Yeow Gan1, Koh, Drake1, Ti In, Michael Gantalao1, Boon Pek Liew1, Teck Wah Park1, Ng, Geraldine1, Yong Bo Yang1, Teh, Daniel1, Suthiwongsunthorn, Nathapong1, Chungpaiboonpatana, Surasit1
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2012 1st Quarter, Vol. 9 Issue 1, p19-30. 12p.
Autor:
Tan, Kwan Ling, Chen, Weiguo, Damalerio, Ramona, Lim, Ruiqi, Chungpaiboonpatana, Surasit, Cheng, Ming-Yuan
Publikováno v:
2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-4, 4p
Publikováno v:
IEEE Transactions on Advanced Packaging; May2005, Vol. 28 Issue 2, p278-287, 10p
Autor:
Chungpaiboonpatana, S., Shi, F.G.
Publikováno v:
IEEE Transactions on Device & Materials Reliability; Sep2004, Vol. 4 Issue 3, p467-481, 15p