Zobrazeno 1 - 10
of 40
pro vyhledávání: '"Supong, Aola"'
Publikováno v:
Journal of the Serbian Chemical Society, Vol 89, Iss 4, Pp 565-580 (2024)
In this work, cheap and locally available pinecones of Pinus kiseya were used as a precursor to prepare activated carbon using single-step KOH activation for the removal of fluoride from water. The prepared activated carbon’s BET surface area, and
Externí odkaz:
https://doaj.org/article/bb729b95c67b4527a1336c8e6400229d
Autor:
Supong, Aola, Chandra Bhomick, Parimal, Karmaker, Rituparna, Sinha, Dipak, Bora Sinha, Upasana
Publikováno v:
In Chemical Physics Letters September 2024 850
Autor:
Sharma, Shisak, Ezung, Soremo L., Supong, Aola, Baruah, Mridushmita, Kumar, Suraj, Umdor, Raplang Steven, Sinha, Dipak
Publikováno v:
In Chemical Engineering Research and Design February 2023 190:777-792
Publikováno v:
In Sustainable Chemistry and Pharmacy May 2022 26
Autor:
Supong, Aola, Bhomick, Parimal Chandra, Karmaker, Rituparna, Ezung, Soremo L., Jamir, Latonglila, Sinha, Upasana Bora, Sinha, Dipak
Publikováno v:
In Applied Surface Science 1 November 2020 529
Autor:
Supong, Aola, Bhomick, Parimal Chandra, Baruah, Mridushmita, Pongener, Chubaakum, Sinha, Upasana Bora, Sinha, Dipak
Publikováno v:
In Sustainable Chemistry and Pharmacy September 2019 13
Autor:
Bhomick, Parimal Chandra, Supong, Aola, Baruah, Mridushmita, Pongener, Chubaakum, Sinha, Dipak
Publikováno v:
In Sustainable Chemistry and Pharmacy December 2018 10:41-49
Autor:
Pongener, Chubaakum, Bhomick, Parimal Chandra, Supong, Aola, Baruah, Mridushmita, Sinha, Upasana Bora, Sinha, Dipak
Publikováno v:
In Journal of Environmental Chemical Engineering April 2018 6(2):2382-2389
Autor:
Supong, Aola1 (AUTHOR) aolas@rediffmail.com, Sinha, Upasana Bora1 (AUTHOR), Sinha, Dipak1 (AUTHOR) dipaksinha@gmail.com
Publikováno v:
Surfaces (2571-9637). Jun2022, Vol. 5 Issue 2, p280-289. 10p.
Autor:
Bhomick, Parimal Chandra, Supong, Aola, Kumar, Suraj, Sema, Akito I., Merry, Thechano, Sinha, Dipak
Publikováno v:
Water Conservation Science & Engineering; 9/15/2023, Vol. 8 Issue 1, p1-15, 15p