Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Sunjung Byun"'
Autor:
Hyeong-Ju Kim, In-Sun Jung, Seyoung Jung, Dongmin Kim, Daiki Minami, Sunjung Byun, Taejin Choi, Jisoo Shin, Sungyoung Yun, Chul-Joon Heo, Kyung-Bae Park, Soo Young Park, Seon-Jeong Lim, Hyo Sug Lee, Byoungki Choi
Publikováno v:
ACS Applied Materials & Interfaces. 14:4360-4370
A novel series of donor (D)-π-acceptor (A) merocyanine molecules harnessed with intramolecular chalcogen bonding (ChaB) is designed, synthesized, and characterized. ChaB comprises periodic chalcogen atoms, S, Se, and Te, and a neighboring oxygen ato
Autor:
In-Sun Jung, Dongmin Im, Hyoyoung Lee, Hyangsook Lee, Daeun Yu, Yun Dongjin, Mokwon Kim, Hyuk Jae Kwon, Do-Young Kim, Jaeduck Jang, Jung-Hwa Kim, Hyunju An, Sunjung Byun
Publikováno v:
Journal of Materials Chemistry A. 7:10397-10404
A graphene-based porous electrode for a lithium–oxygen (Li–O2) battery is investigated for use in next generation energy storage systems. The porosity of the cathode electrode in Li–O2 batteries is a key factor in increasing their oxygen diffus
Autor:
Eun-Kyung Lee, Myung-Sup Jung, Bang-Lin Lee, Young-Nam Kwon, Sunjung Byun, Joo-Young Kim, Ji Whan Kim, Jang-Joo Kim, Jeong-Il Park
Publikováno v:
Journal of Materials Chemistry C. 6:13359-13366
A polymeric insulating material cured at the low temperature of 130 °C through the thermal cross-linking reaction of poly(hydroxy imide) (PHI) and 2,2′-bis(4-(2-(vinyloxy)ethoxy)phenyl)propane (BPA-DEVE) was characterized to determine its applicab
Publikováno v:
Polymer. 68:293-301
Toughness and high elastic elongation are important requirements for polyimide films used as substrates in flexible displays. However, these properties can be altered by imidization during the thermal treatment. In the present study, we investigated
Publikováno v:
Polymer. 59:200-206
We report the thermal transition and concomitant morphology change of polyimide films, investigated through dynamic mechanical analyses, thermo-mechanical analyses, and X-ray diffraction spectroscopy. For this study, highly transparent polyimide film
Publikováno v:
ACS Applied Materials & Interfaces. 6:6054-6061
Through hydrolysis and polycondensation of amino-silane with alkyl bridged silane, a new type of polysilsesquioxane (PSSQ) was obtained. Here we use amine functionalized silane and bis(silyl)ethane to synthesize alkyl chain linked PSSQ. Compared to c
Autor:
Shi-Woo Rhee, Jung-Min Kim, Dong-Jin Yun, Sunjung Byun, Gyeong-Su Park, Hyemin Ra, Sung-Hoon Park, Hyun-Suk Kim
Publikováno v:
Organic Electronics. 14:2962-2972
The effects of the surfactant elimination from single wall carbon tube (SWNT) films on the physical/electrical properties of SWNT films are concretely studied. The surfactant, which helps to disperse the SWNTs in polar solvent without damage, complet
Autor:
Jai-Kwang Shin, EunAe Cho, Jae Gwan Chung, Hyung-Ik Lee, SeongMin Kim, Ki-Hong Kim, Sunjung Byun, Jong-Bong Park, Park Yong Young, Woo Young Yang, Wenxu Xianyu, Yong Koo Kyoung
Publikováno v:
Scientific Reports
Scientific Reports, Vol 7, Iss 1, Pp 1-8 (2017)
Scientific Reports, Vol 7, Iss 1, Pp 1-8 (2017)
We report on the degradation process by water vapor of hydrogenated amorphous silicon oxynitride (SiON:H) films deposited by plasma-enhanced chemical vapor deposition at low temperature. The stability of the films was investigated as a function of th
Autor:
Jinyoung Hwang, Dong-Jin Yun, Jung-Min Kim, Sunjung Byun, Seunghyup Lee, Hyemin Ra, Changhoon Jung, Sung-Hoon Park
Publikováno v:
Nanotechnology. 29:395704
In this study, composite films made of coiled carbon nanotubes (CCNTs) and poly(3,4-ethylenedioxythiophene) polymerized with poly(4-styrenesulfonate) (PEDOT:PSS) were fabricated with different composition ratios. The variations in film properties (in
Autor:
Ye-Hoon Kim, Sunjung Byun, Jung-hyeon Kim, Ilsub Chung, Suk-pil Kim, Jeong-Uk Han, Su-Hyung Kim
Publikováno v:
PRICM: 8 Pacific Rim International Congress on Advanced Materials and Processing
We studied how hillock in Al film increases the contact resistance (RC) between bottom-side metal stacked (Al-Ti-TiN) and upper-side W-via-plugs in the backend-structure of the semiconductor. The general structure is the via-etch-stop-on-TiN (VEST),
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31defc1b2690944713ef1bf3f31e25be
https://doi.org/10.1002/9781118792148.ch232
https://doi.org/10.1002/9781118792148.ch232