Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Sungyoon, Ryu"'
Autor:
Sunhong Jun, Wonjun Choi, DongHoon Kim, Hayan Park, Dongmin Kyeon, Kyounghwan Lee, Yong-Ju Jeon, Chaemin Lee, Kwangchul Kim, Jeongsu Han, Sungyoon Ryu, Younghoon Sohn, Yongdeok Jeong
Publikováno v:
Metrology, Inspection, and Process Control XXXVII.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a829ed44f146688783070c04d8235780
https://doi.org/10.1117/12.2657062
https://doi.org/10.1117/12.2657062
A study on defect signal improvement using multi-scan optic patch images and new detection algorithm
Publikováno v:
Metrology, Inspection, and Process Control XXXVII.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea5fa00ee95a176d9c2b0cc765779f24
https://doi.org/10.1117/12.2657845
https://doi.org/10.1117/12.2657845
Autor:
DongHoon Kim, Sungyoon Ryu, Sunhong Jun, Heeyoon Han, Wonjun Choi, Yong-Ju Jeon, Hyun Lee, Souk Kim, Younghoon Sohn
Publikováno v:
Metrology, Inspection, and Process Control XXXVII.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4f2305f51efd0dd83961b36bcc7a105
https://doi.org/10.1117/12.2657064
https://doi.org/10.1117/12.2657064
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d21db65774e124fdda261fae71a500e
https://doi.org/10.1117/12.2612710
https://doi.org/10.1117/12.2612710
Autor:
Sungyoon Ryu, Donghoon Kim, Sunhong Jun, Suho Ryu, JaeHyung Ahn, Hyun Lee, KwangEun Kim, Yusin Yang, Younghoon Sohn
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f258cddbb84ad95f774c56c93f3ff2d
https://doi.org/10.1117/12.2613631
https://doi.org/10.1117/12.2613631
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce317eb5c48cd3129cdf633dea1f74bb
https://doi.org/10.1117/12.2613619
https://doi.org/10.1117/12.2613619
Publikováno v:
Microscopy and Microanalysis. 28:800-801
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad845a4b3e0aeff08aaad145d25aff74
https://doi.org/10.1017/s1431927622003609
https://doi.org/10.1017/s1431927622003609
Publikováno v:
Optical Measurement Systems for Industrial Inspection XII.
The era of big data and cloud computing services has driven the demand for higher capacity and more compact semiconductor devices. As a result, semiconductor devices are moving from 2-D to 3-D. Most notably, threedimensional (3D) NAND flash memory is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ef76e584541e993e154285e28d2205e
https://doi.org/10.1117/12.2592216
https://doi.org/10.1117/12.2592216
Publikováno v:
Microscopy and Microanalysis. 27:792-793
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae0af801c88ef628ef10d8217f01a3ae
https://doi.org/10.1017/s1431927621003147
https://doi.org/10.1017/s1431927621003147
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXII.
In semiconductor industry, fast and effective measurement of pattern variation has been key challenge for assuring massproduct quality. Pattern measurement techniques such as conventional CD-SEMs or Optical CDs have been extensively used, but these t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afae4cc601a7e83f8013b62f780b506f
https://doi.org/10.1117/12.2296448
https://doi.org/10.1117/12.2296448