Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Sunghwan Min"'
Autor:
Kiyoung Kim, Namdoo Kim, Jongryeol Jeong, Sunghwan Min, Horim Yang, Ram Vijayagopal, Aymeric Rousseau, Suk Won Cha
Publikováno v:
Energies, Vol 14, Iss 11, p 3147 (2021)
Many leading companies in the automotive industry have been putting tremendous effort into developing new powertrains and technologies to make their products more energy efficient. Evaluating the fuel economy benefit of a new technology in specific p
Externí odkaz:
https://doaj.org/article/e423171fa2a745f4b68b622a9ac8540c
Publikováno v:
Korean Development Economics Association. 25:29-54
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c35d9b8b6b064200bf6c804a09ace89
https://doi.org/10.20464/kdea.2019.25.3.2
https://doi.org/10.20464/kdea.2019.25.3.2
Autor:
Ho-Rim Yang, Suk Won Cha, Namdoo Kim, Kiyoung Kim, Ram Vijayagopal, Aymeric Rousseau, Jongryeol Jeong, Sunghwan Min
Publikováno v:
Energies; Volume 14; Issue 11; Pages: 3147
Energies, Vol 14, Iss 3147, p 3147 (2021)
Energies, Vol 14, Iss 3147, p 3147 (2021)
Many leading companies in the automotive industry have been putting tremendous effort into developing new powertrains and technologies to make their products more energy efficient. Evaluating the fuel economy benefit of a new technology in specific p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c828a2e3c561e76a9bea846851e240d8
Autor:
Max Sunghwan Min, Sylvie Kadivar
Publikováno v:
2020 International Wafer Level Packaging Conference (IWLPC).
The explosion of big data along with the accelerated global socio economical transformations we are experiencing are dramatically transforming the way we live and work. These shifts are accelerating HPC, 5G, Mobile, AR/VR, IoT, Networking and AI infr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3215c633423e0d233a4597fa07c1d1d
https://doi.org/10.23919/iwlpc52010.2020.9375855
https://doi.org/10.23919/iwlpc52010.2020.9375855
Autor:
Woonghwan Ryu, Max Sunghwan Min, Seung-Yong Cha, Eileen You, Se-ho You, GaWon Kim, Melinda Ling Yang, Seungbae Lee, Harpreet Gill, Young-Hoon Kim, Anil Gundurao
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
In this paper, a BGA package having a ARM SoC chip is introduced, which has component-type embedded decoupling capacitors (decaps) for good power integrity performance of core power. To evaluate and confirm the impact of embedded decap on core PDN (p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e021651d60cb688a06889a705f1edfe5
https://doi.org/10.1109/ectc.2014.6897311
https://doi.org/10.1109/ectc.2014.6897311
Autor:
GaWon Kim, Max Sunghwan Min, Dinh T. Tran, Seung-Yong Cha, Se-ho You, Baekkyu Choi, Harold Bautista, Nian Zhou
Publikováno v:
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems.
In this paper, a DDR3L simulation topology for ARM SoC application is presented and the impact of the board power delivery network (PDN) on a DDR3L memory interface is simulated and analyzed. The analysis of the DDR3L PDN of the package and board wil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43758a8ff002b00651a5de033fcc2940
https://doi.org/10.1109/epeps.2013.6703502
https://doi.org/10.1109/epeps.2013.6703502
Publikováno v:
CCNC
Shadow 3D is an extended version of Shadow, a GUI middleware for home digital media devices. In addition to Shadow's 2D GUI features, Shadow 3D supports a full range of 3D GUI features including OpenGL-based low-level 3D graphics, 3D object managemen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3658cdf7b9a2ecd407473cdfe482ec5
https://doi.org/10.1109/ccnc08.2007.148
https://doi.org/10.1109/ccnc08.2007.148
Autor:
Myunggeun Park, Sunghwan Min, Yukwon Jeon, Altalsukh Dorjgotov, Yong Gun Shul, Sang-Hoon Hyun
Publikováno v:
ECS Meeting Abstracts. :282-282
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::837c5636b6bcfdf3c78de5e97a6bd676
https://doi.org/10.1149/ma2012-01/6/282
https://doi.org/10.1149/ma2012-01/6/282
Publikováno v:
ECS Meeting Abstracts. :782-782
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad12f6143a1a4f0e2ceef8dca2e9e515
https://doi.org/10.1149/ma2011-01/12/782
https://doi.org/10.1149/ma2011-01/12/782
Autor:
Seunghyun Hwang1, Sunghwan Min2, Swaminathan, Madhavan2, Venkatakrishnan, Venkatesan2, Hunter Chan2, Fuhan Liu2, Sundaram, Venky2, Kennedy, Scott1, Baars, Dirk1, Lacroix, Benjamin2, Yuan Li2, Papapolymerou, John2
Publikováno v:
IEEE Transactions on Advanced Packaging. Feb2010, Vol. 33 Issue 1, p180-188. 9p. 1 Color Photograph, 2 Diagrams, 2 Charts, 12 Graphs.