Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Sungho Seo"'
Autor:
Seulki Min, Seung Moo Lee, Seungmoon Choi, Sungho Seo, Chul Hyun Cho, Chung Yean Cho, Young I.I. Kim, Ji Won Hur, Sungkil Lee, Eunbi Seol, Dooyoung Jung, Gerard Jounghyun Kim, Heon Jeong Lee, Seo Yeon Jung
Publikováno v:
Psychiatry Investigation
With proper guidance, virtual reality (VR) can provide psychiatric therapeutic strategies within a simulated environment. The visuo-haptic-based multimodal feedback VR solution has been developed to improve anxiety symptoms through immersive experien
Synthesis and thermoelectric characterization of bulk-type tellurium nanowire/polymer nanocomposites
Autor:
Seil Kim, Nosang V. Myung, Hong-Baek Cho, Jae-Hong Lim, Young-In Lee, Yong-Ho Choa, Bongyoung Yoo, Yoseb Song, Seung Han Ryu, Tae-Yeon Hwang, Sungho Seo
Publikováno v:
Journal of Materials Science. 52:12724-12733
A simple method to fabricate three-dimensionally (3-D) aligned thermoelectric nanowires attached polymer particle was demonstrated by combination of solution casting of thermoelectric nanostructures (e.g., tellurium nanowires (Te NWs)) on the surface
Publikováno v:
Journal of Alloys and Compounds. 706:576-583
The combination technique of ball-milling and sintering is commonly employed to manufacture high performance thermoelectric materials. However, during ball-milling and sintering, it is hard to avoid inclusion of oxygen in the lattice, which results i
Publikováno v:
Journal of Alloys and Compounds. 696:1151-1158
A reduction in the grain size of p-type thermoelectric materials, which increases phonon scattering at grain boundaries, can increase the figure of merit ( ZT) due to decreased lattice thermal conductivity. Small grains are often observed in samples
Publikováno v:
Journal of Nanoscience and Nanotechnology. 16:11303-11307
Autor:
Bongyoung Yoo, Sungho Seo
Publikováno v:
Journal of Nanoscience and Nanotechnology. 16:11267-11271
Publikováno v:
Microelectronic Engineering. 156:15-18
The through-Si-via (TSV) interconnection provides the ideal 3D interconnection in a next generation semiconductor device which has significantly innovated function, excellent performance and high efficiency. In this study, TSV fillings by electrodepo
Publikováno v:
The Journal of Physical Chemistry C. 119:18038-18045
Silver is a well-known element for use as a p-type dopant in Bi2Te3-related compounds. In this paper, an efficient method for incorporating ultralow Ag dopant concentrations (
Autor:
Seungmoon Choi, Seungmoo Lee, Seulki Min, Gerard Jounghyun Kim, Chungyean Cho, Jaedong Lee, Seoyeon Jung, Dooyoung Jung, Chul Hyun Cho, Sungho Seo, Youngil Lee, Eunbi Seol
Publikováno v:
VRST
In this paper, we present a virtual reality based content/system called the "Drop the beat" designed to help the mindfulness and train one to overcome panic disorder. The two main elements of the proposed system are the (1) use of 360-degree video fo
Publikováno v:
Journal of The Electrochemical Society. 161:D425-D428
The effect of Cu dissolution during pulse electrodeposition process on the generation of high density nanoscale twin structure was investigated. During off-time, the density of nuclei was reduced by acidity of electrolytes. The reduction in the densi