Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Sung-Jie Huang"'
Publikováno v:
International Journal of Automation and Smart Technology, Vol 5, Iss 2, Pp 101-105 (2015)
Thermo-elastic strain is induced by through silicon vias (TSV) due to the difference of thermal expansion coefficients between the copper (∼18 ppm/◦C) and silicon (∼2.8 ppm/◦C) when the structure is exposed to a thermal budget in the three di
Externí odkaz:
https://doaj.org/article/109b501088ae46d7a99083194a68d606
Autor:
Sung-Jie Huang, 黃崧芥
102
In this thesis, we used magnetron sputtering deposition technique to deposit the magnetic complex thin film that integrates Fe51Pt49 into BaTiO3 thin film capacitor. The capping layer of Fe51Pt49 have three different directions and the size
In this thesis, we used magnetron sputtering deposition technique to deposit the magnetic complex thin film that integrates Fe51Pt49 into BaTiO3 thin film capacitor. The capping layer of Fe51Pt49 have three different directions and the size
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/84368884162743776967
