Zobrazeno 1 - 10
of 219
pro vyhledávání: '"Sung-Hoon Choa"'
Autor:
Su-Young Chai, Sung-Hoon Choa
Publikováno v:
Crystals, Vol 13, Iss 12, p 1665 (2023)
Plasma doping (PLAD) technology is widely used in the semiconductor industry. One of the problems associated with PLAD is precise dosage control and monitoring during the doping process. Excessive boron doping into the n-type poly gate will affect th
Externí odkaz:
https://doaj.org/article/fcd5b0cdca4542a99bc3d1bae7676bd1
Autor:
Xuan-Luc Le, Xuan-Bach Le, Yuhwan Hwangbo, Jiho Joo, Gwang-Mun Choi, Yong-Sung Eom, Kwang-Seong Choi, Sung-Hoon Choa
Publikováno v:
Micromachines, Vol 14, Iss 3, p 601 (2023)
The aim of this study was to develop a flexible package technology using laser-assisted bonding (LAB) technology and an anisotropic solder paste (ASP) material ultimately to reduce the bonding temperature and enhance the flexibility and reliability o
Externí odkaz:
https://doaj.org/article/3da9defe5bf1426b86b7b283d646fdb9
Publikováno v:
Micromachines, Vol 13, Iss 4, p 537 (2022)
The hybrid wafer bonding technique is drawing much interest in relation to three-dimensional integration technology, and its areas of application are expanding from image sensors to semiconductor memory packages. In hybrid bonding, the bond strength
Externí odkaz:
https://doaj.org/article/92c09e96170942cf9275d928637925eb
Autor:
Su-Young Chai, Sung-Hoon Choa
Publikováno v:
Crystals, Vol 11, Iss 9, p 1106 (2021)
Recently, the demand of a high resolution complementary metal-oxide semiconductor (CMOS) image sensor is dramatically increasing. As the pixel size reduces to submicron, however, the quality of the sensor image decreases. In particular, the dark curr
Externí odkaz:
https://doaj.org/article/6c88219339304b96a91c63ee6fcfc113
Autor:
Xuan Luc Le, Sung-Hoon Choa
Publikováno v:
Crystals, Vol 11, Iss 5, p 485 (2021)
As fine-pitch 3D wafer-level packaging becomes more popular in semiconductor industries, wafer-level prebond testing of various interconnect structures has become increasingly challenging. Additionally, improving the current-carrying capacity (CCC) a
Externí odkaz:
https://doaj.org/article/90bb68cabfc1494eb50b3dc3f5e9243b
Autor:
Jongwon Yoon, Yunkyung Jeong, Heeje Kim, Seonggwang Yoo, Hoon Sun Jung, Yonghun Kim, Youngkyu Hwang, Yujun Hyun, Woong-Ki Hong, Byoung Hun Lee, Sung-Hoon Choa, Heung Cho Ko
Publikováno v:
Nature Communications, Vol 7, Iss 1, Pp 1-10 (2016)
The fabrication of smart textiles is currently relying on the printing of ultrathin electronics on fabric, which is subject to the poor adhesion between electronics and textile. Here, Yoon et al. propose the use of cilia-like structure to improve adh
Externí odkaz:
https://doaj.org/article/95b0e3e14daf47c89860cf72d3745ad1
Publikováno v:
Sensors, Vol 11, Iss 3, Pp 2580-2591 (2011)
One of the key components of a chemical gas sensor is a MEMS micro-heater. Micro-heaters are used in both semiconductor gas sensors and NDIR gas sensors; however they each require different heat dissipation characteristics. For the semiconductor gas
Externí odkaz:
https://doaj.org/article/bb6bb78a0d084b14bf485cb1ead894a9
Publikováno v:
Metals and Materials International. 29:1311-1322
Publikováno v:
International Journal of Precision Engineering and Manufacturing. 23:347-359
Autor:
Byeong-In Choi, Sung-Hoon Choa
Publikováno v:
Journal of the Institute of Electronics and Information Engineers. 58:3-13