Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Sung-Geun Kang"'
Autor:
Sung Ryong Kim, Hyoung Shick Kang, Tae Gyun Kim, Bong Chan Kim, Sung Geun Kang, Yul Kyun Ahn, Seung Woon Song
Publikováno v:
Korean Journal of Breeding Science. 45:468-473
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::165d9b18e39ae7a73ab2e9531025f7c5
https://doi.org/10.9787/kjbs.2013.45.4.468
https://doi.org/10.9787/kjbs.2013.45.4.468
Autor:
Young Chul Park, Joong Seok Lee, Hyun Woo Oh, Jong Hoon Kang, Sanghoon Kang, Seok Cheon Chin, Sung Geun Kang
Publikováno v:
Korean Journal of Plant Resources. 26:143-147
`Sangdojosaeng` is a new cultivar from bud spot of Citrus unshiu `Sasaki unshiu` which has late maturity habit. It was found in 1996, and primary selected and named as `JARES108` in 1998. `JARES108` was grafted on to adult satsuma mandarin trees in S
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59e171df80916edf2564d2eec0b4eafc
https://doi.org/10.7732/kjpr.2013.26.1.143
https://doi.org/10.7732/kjpr.2013.26.1.143
Publikováno v:
Electronic Materials Letters. 9:7-11
The effects of heat treatment on room temperature ferromagnetism of Co-doped ZnO were investigated with a (ZnO 20A/Co x A)20 multilayer structure where x = 1.5, 3, 4.3, 6 and 9 A. As the thickness of the Co sub-layer increased, the ZnO/Co multilayer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c6361ba0c977a4ddd86fea746af0167
https://doi.org/10.1007/s13391-012-1094-2
https://doi.org/10.1007/s13391-012-1094-2
Autor:
Sungdong Kim, Soo-Hyung Kim, Eun-Sol Kim, Ji Eun Lee, Sarah Eunkyung Kim, Sung-Geun Kang, Na-Eun Lim
Publikováno v:
Journal of the Microelectronics and Packaging Society. 19:29-33
The demand for 3D wafer level integration has been increasing significantly. Although many technical challenges of wafer stacking are still remaining, wafer stacking is a key technology for 3D integration due to a high volume manufacturing, smaller p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a029e5fa0dd6961643f092bc7ac75efe
https://doi.org/10.6117/kmeps.2012.19.2.029
https://doi.org/10.6117/kmeps.2012.19.2.029
Publikováno v:
Current Applied Physics. 11:S119-S123
In 3D wafer-stacking technology, one of the major manufacturing issues is wafer warpage because it causes process and product failures, such as delamination, cracking, mechanical stresses, and even electrical failure. In this study, the wafer warpage
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::34d8cc7c41c091bd28bb4a9fdd4229e8
https://doi.org/10.1016/j.cap.2011.01.052
https://doi.org/10.1016/j.cap.2011.01.052
Autor:
Won-Jun Lee, Martin Schlott, Hyung Suk Park, Sa-Kyun Rha, Suk-Jae Lee, Sung-Geun Kang, Sung-kyu Kang, Byeol Han
Publikováno v:
Surface and Coatings Technology. 205:S68-S72
Pure Cu film and Cu(Mg) films having 1–4.5 at.% Mg were sputter-deposited on glass substrates, and annealed in vacuum at varying temperatures up to 400 °C. We investigated the effects of the Mg content and the annealing temperature on the resistiv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1905706fa7159633ce4ad2dd4c93e883
https://doi.org/10.1016/j.surfcoat.2010.04.032
https://doi.org/10.1016/j.surfcoat.2010.04.032
Autor:
Sung-Geun Kang, Hyun Woo Oh, Jong Yul Roh, Hyun-Woo Park, S S Gill, Yeon Ho Je, Dae-Weon Lee, B.R. Jin
Publikováno v:
Letters in Applied Microbiology. 24:451-454
Bacillus thuringiensis NTB-1 isolated from soil samples in Korea produces ovoidal parasporal inclusions with proteins of approximately 24-40 kl)a in size. Although serological study indicated that the isolate has a flagella (H) antigen identical with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f4f2c0a2765ab965ec721b5c43941b9
https://doi.org/10.1046/j.1472-765x.1997.00038.x
https://doi.org/10.1046/j.1472-765x.1997.00038.x
Autor:
Youngrae Kim, Na-Eun Lim, Ji Eun Lee, Sarah Eunkyung Kim, Sung-Geun Kang, Sungdong Kim, Teakgyu Jeong, Eun-Sol Kim
Publikováno v:
3DIC
3D wafer stacking [1–3] offers numerous opportunities such as memory stacking, logic stacking, heterogeneous device stacking, optical and RF interconnection, and system-on-chip. 3D integration can provide high performance, reduced cost, reduced siz
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f6cf1fb352c4b406e10a168b2d2203d9
https://doi.org/10.1109/3dic.2012.6263014
https://doi.org/10.1109/3dic.2012.6263014
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
3D (three-dimensional) wafer stacking technology has been developed extensively recently. Among many technical challenges in 3D stacked wafers the wafer warpage is one of the important processing issues to be resolved because the wafer warpage is one
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39feef990e1eac127a9a77ea099d868a
https://doi.org/10.1109/eptc.2009.5416405
https://doi.org/10.1109/eptc.2009.5416405
Publikováno v:
ResearcherID
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f50efbdeee77b829c1c0e93ba90df3fa
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000262520300037&KeyUID=WOS:000262520300037
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000262520300037&KeyUID=WOS:000262520300037
