Zobrazeno 1 - 10
of 571
pro vyhledávání: '"Sung Kyu Lim"'
Autor:
Michael Hoffmann, Zheng Wang, Nujhat Tasneem, Ahmad Zubair, Prasanna Venkatesan Ravindran, Mengkun Tian, Anthony Arthur Gaskell, Dina Triyoso, Steven Consiglio, Kandabara Tapily, Robert Clark, Jae Hur, Sai Surya Kiran Pentapati, Sung Kyu Lim, Milan Dopita, Shimeng Yu, Winston Chern, Josh Kacher, Sebastian E. Reyes-Lillo, Dimitri Antoniadis, Jayakanth Ravichandran, Stefan Slesazeck, Thomas Mikolajick, Asif Islam Khan
Publikováno v:
Nature Communications, Vol 13, Iss 1, Pp 1-8 (2022)
Applying an electric field to an antiferroelectric material transforms its non-polar crystal structure into a polar one. Here, the authors show that the antiferroelectric transition in zirconia causes a negative capacitance, useful for electronics.
Externí odkaz:
https://doaj.org/article/a3714ccb4ef949fda04b550a059cfdef
Publikováno v:
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, Vol 7, Iss 1, Pp 26-34 (2021)
In a 2-D design, the block pins are located at the periphery of a block optimally since blocks are placed side-by-side horizontally in a single placement layer. However, monolithic 3-D (M3D) integration relieves this boundary constraint by allowing v
Externí odkaz:
https://doaj.org/article/8c4123e96c08456c8d1ab32441e1ddd5
Publikováno v:
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, Vol 7, Iss 2, Pp 106-114 (2021)
This article presents monolithic-3-D (M3D) SRAM arrays using multiple tiers of carbon nanotube (CNT) transistors. The compiler automatically generates single-tier 2-D SRAM subarrays and multitier 3-D SRAM subarrays with different tiers for cells and
Externí odkaz:
https://doaj.org/article/df1b2c62224146cda435cc567414f305
Publikováno v:
Applied Sciences, Vol 11, Iss 24, p 12151 (2021)
We have simulated a monolithic three-dimensional inverter (M3DINV) structure by considering the interfacial trap charges generated thermally during the monolithic three-dimensional integration process. We extracted the SPICE model parameters from M3D
Externí odkaz:
https://doaj.org/article/a4aecb52b7544b99ae2597dae0977606
Publikováno v:
Micromachines, Vol 10, Iss 10, p 637 (2019)
In order to simulate a circuit by applying various logic circuits and full chip using the HSPICE model, which can consider electrical coupling proposed in the previous research, it is investigated whether additional electrical coupling other than ele
Externí odkaz:
https://doaj.org/article/5a3e87d5d75f4118b63d694a82cb4f81
The Impact of 3D Stacking and Technology Scaling on the Power and Area of Stereo Matching Processors
Publikováno v:
Sensors, Vol 17, Iss 2, p 426 (2017)
Recently, stereo matching processors have been adopted in real-time embedded systems such as intelligent robots and autonomous vehicles, which require minimal hardware resources and low power consumption. Meanwhile, thanks to the through-silicon via
Externí odkaz:
https://doaj.org/article/17ac8579196f444d92103dbf3f8d4851
Publikováno v:
ACM Transactions on Design Automation of Electronic Systems. 28:1-22
Modern electronic design automation flows depend on both implementation and signoff tools to perform timing-constrained power optimization through Engineering Change Orders (ECOs), which involve gate sizing and threshold-voltage ( V th )-assignment o
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 42:1295-1308
Autor:
Anthony Agnesina, Moritz Brunion, Jinwoo Kim, Alberto Garcia-Ortiz, Dragomir Milojevic, Francky Catthoor, Gioele Mirabelli, Manu Komalan, Sung Kyu Lim
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:300-314
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 31:296-309