Zobrazeno 1 - 10
of 31
pro vyhledávání: '"Sung－Min Jeon"'
Autor:
Sung-Min Jeon, Enkhzaya Davaa, Ratchapol Jenjob, Chiravoot Pechyen, Sitakan Natphopsuk, Seok Jeong, Hye Jin Yoo, Su-Geun Yang
Publikováno v:
International Journal of Molecular Sciences, Vol 25, Iss 8, p 4317 (2024)
Irreversible electroporation (IRE) is a prominent non-thermal ablation method widely employed in clinical settings for the focal ablation therapy of solid tumors. Utilizing high-voltage, short-duration electric pulses, IRE induces perforation defects
Externí odkaz:
https://doaj.org/article/29b8b3621bce40d8a074ffba468483c5
Autor:
Sung-Min Jeon PhD, Enkhzaya Davaa PhD, Yixin Jiang PhD, Ratchapol Jenjob PhD, Ngoc-Thuan Truong Ms, Kyung-Ju Shin PhD, Seok Jeong MD, PhD, Su-Geun Yang PhD
Publikováno v:
Technology in Cancer Research & Treatment, Vol 22 (2023)
Irreversible electroporation (IRE) is a non-thermal and minimal invasive modality to ablate pathologic lesions such as hepatic tumors. Histological analysis of the initial lesions after IRE can help predict ablation efficacy. We aimed to investigate
Externí odkaz:
https://doaj.org/article/d24076a92d0947be880251ccb5c3d198
Autor:
Young-Ran Yoo, Gyubinn Kim, Sung-Min Jeon, Hyun-Jun Park, Won-Wook Seo, Jeong-Tak Moon, Young-Sik Kim
Publikováno v:
Materials, Vol 16, Iss 23, p 7275 (2023)
Wire bonding, one of the methods for electrically connecting a semiconductor chip with a substrate, involves attaching thin metal wires to pads. It is the oldest electrical connection method that exhibits high compatibility with other processes. The
Externí odkaz:
https://doaj.org/article/f526380add13402e8e15403534515811
Autor:
Sung-Min Jeon, Sang-Hyuk Lee
Publikováno v:
korean management review. 52:391-414
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::369087d8d8c5965aa9631b3d691f8388
https://doi.org/10.17287/kmr.2023.52.2.391
https://doi.org/10.17287/kmr.2023.52.2.391
Autor:
Sung-Min Jeon, Sang-Hyuk Lee
Publikováno v:
korean management review. 52:137-159
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf7f276679f1f4800c4291a772886ba6
https://doi.org/10.17287/kmr.2023.52.1.137
https://doi.org/10.17287/kmr.2023.52.1.137
Publikováno v:
Journal of Taxation and Accounting. 23:93-124
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e1a33fcf54e1075d465ab041250c6ff
https://doi.org/10.35850/kjta.23.3.04
https://doi.org/10.35850/kjta.23.3.04
Autor:
Sung-Min Jeon, Sang-Yeob Kim, Sung-Young Lee, Hyun-Jun Park, Mi-Rang Ra, Mong-Hyun Cho, Jeong-Tak Moon
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a945b9d3b2c09f5dd1c9e2c4e4f89334
https://doi.org/10.1109/eptc56328.2022.10013192
https://doi.org/10.1109/eptc56328.2022.10013192
Publikováno v:
Journal of Welding and Joining. 39:343-348
Gold-coated silver wire was developed to alleviate the high cost of Au wire used in semiconductor packaging. Ball-bonding and stitch-bonding techniques were used to fabricate the dummy packaging material, comprising 97.3 % Ag, 97.3% Au-Coated Ag, and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e2a2076da1dd4d0b4edce25e823bdba
https://doi.org/10.5781/jwj.2021.39.4.1
https://doi.org/10.5781/jwj.2021.39.4.1
Publikováno v:
New Physics: Sae Mulli. 71:111-116
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8568394343311cfec0d90a408daa10e2
https://doi.org/10.3938/npsm.71.111
https://doi.org/10.3938/npsm.71.111
Publikováno v:
Korean Journal of Business Ethics. 19:1-27
본 연구는 국가별 기업 윤리경영 수준이 기업의 현금 보유량에 미치는 영향을 실증적으로 분석하였다. 보다 구체적으로 본 연구에서는 스위스의 국제경영개발원(International Institute for Managem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32855091c1db0c753fbe84bf985944ca
https://doi.org/10.34273/kjbe.2020.19.2.001
https://doi.org/10.34273/kjbe.2020.19.2.001