Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Sun Tea Jung"'
Autor:
Sang-Won Ha, Kyoung Up Shin, Han Seo Cho, Sun Tea Jung, Byoung-Ho Rhee, Hyo-Hoon Park, Sae-Kyoung Kang, Byung Sup Rho, Taeil Kim, Dong Su Kim, Mu Hee Cho
Publikováno v:
Journal of Micromechanics and Microengineering. 14:1181-1184
We fabricated fiber-embedded boards using a micro-grooving technique for optical interconnects. This approach is quite cost effective and fully compatible with conventional PCB processes. U-shaped grooves were formed on FR-4 plates using a 90? V-shap
Autor:
Sang-Won Ha, Byung Sup Rho, Dongsu Kim, Taeil Kim, Han Seo Cho, Kyoung-Up Shin, Sun Tea Jung, Byoung-Ho Rhee, Mu Hee Cho, Sae-Kyoung Kang, Hyo-Hoon Park
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
A simple method for fabricating fiber- and waveguide-embedded boards for optical interconnects is described. It is quite cost effective and fully compatible with conventional PCB processes. On-board optical link of 2.5Gb/s signals between the transmi
Autor:
Mu Hee Cho, Dongsu Kim, Kyoung-Up Shin, Sae-Kyoung Kang, Sang-Won Ha, Hyo-Hoon Park, Taeil Kim, Byoung-Ho Rhee, Byung Sup Rho, Han Seo Cho, Sun Tea Jung
Publikováno v:
The 6th International Conference on Advanced Communication Technology, 2004..
A simple method for fabricating fiber-embedded boards using a grooving technique for optical interconnects is described. It is quite cost effective and fully compatible with conventional PCB processes. On-board optical link of 2.5Gb/s signals between
Autor:
Han Seo Cho, Saekyoung Kang, Mu Hee Cho, Byung Sup Rho, Hyo-Hoon Park, Kyoung-up Shin, Sang-Won Ha, Byoung-Ho Rhee, Dong-Su Kim, Sun Tea Jung, Taeil Kim
Publikováno v:
6th International Conference on Advanced Communication Technology, 2004; 2004, p286-290, 5p
Autor:
Han Seo Cho, Byung Sup Rho, Saekyoung Kang, Mu Hee Cho, Hyo-Hoon Park, Kyoung-Up Shin, Sang-Won Ha, Byoung-Ho Rhee, Dong-Su Kim, Sun Tea Jung, Taeil Kim
Publikováno v:
2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p1547-1547, 1p