Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Sumio Koiwa"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000865-000905
As electronic product becomes smaller and lighter with an increasing number of function← the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electroni
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::783ff631a2cea3d5b2aac746d77b6eb2
https://doi.org/10.4071/2015dpc-tp41
https://doi.org/10.4071/2015dpc-tp41
Autor:
Satoru Kuramochi, Takamasa Takano, Kousuke Suzuki, Yoshitaka Fukuoka, Sumio Koiwa, Miyuki Akazawa, Hiroshi Mawatari
Publikováno v:
International Symposium on Microelectronics. 2014:000376-000381
As electronic product becomes smaller and lighter with an increasing number of function ↚ the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electron
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7a246fc33d27f85f3f390810c886e09
https://doi.org/10.4071/isom-wa11
https://doi.org/10.4071/isom-wa11
Autor:
Hiroshi Mawatari, Hiroyuki Nagano, Satoru Kuramochi, Yoshitaka Fukuoka, Sumio Koiwa, Kousuke Suzuki, Jiro Iida, Miyuki Akazawa
Publikováno v:
2016 Pan Pacific Microelectronics Symposium (Pan Pacific).
As electronic products becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a9a07cbcb73d9af25b67d218f6f296a
https://doi.org/10.1109/panpacific.2016.7428426
https://doi.org/10.1109/panpacific.2016.7428426
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
As electronic product becomes smaller and lighter with an increasing number of function← the demand for high density and high integration becomes stronger.! Interposers for system in package will became more and more important for advanced electron
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::511602b3de97d2f82c47683f0626e66c
https://doi.org/10.1109/ectc.2014.6897521
https://doi.org/10.1109/ectc.2014.6897521