Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Sukshitha Achar Puttur Lakshminarayana"'
Autor:
Colin V. Greene, Ganesh Subbarayan, Yifan Wu, Raiyo Aspandiar, Nilesh Badwe, John E. Blendell, Carol A. Handwerker, Sukshitha Achar Puttur Lakshminarayana, Yaohui Fan, Travis F. Dale
Publikováno v:
Journal of Electronic Materials. 50:6615-6628
Low reflow temperature solder interconnect technology based on Sn-Bi alloys is currently being considered as an alternative for Sn-Ag-Cu solder alloys to form solder interconnects at significantly lower melting temperatures than required for Sn-Ag-Cu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2012887ba2cbbd03464dd80d2889a5b
https://doi.org/10.1007/s11664-021-09256-1
https://doi.org/10.1007/s11664-021-09256-1
Dissertation/ Thesis
Non-Newtonian fluid models such as the Bingham and Herschel-Bulkley models are used to characterize the flow behavior of many complex fluids and soft solids. The three parameter Herschel-Bulkley model captures the yield stress behavior and the nonlin
Dissertation/ Thesis
Thermal Greases are gap-filling interface materials that are used in semiconductor packages to efficiently transfer heat from the component to the heat sink or spreader. Thermal greases are typically particle filled composite materials comprising of