Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Sukshitha Achar P. L."'
Publikováno v:
International Journal for Numerical Methods in Engineering. 123:1547-1575
Publikováno v:
ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
As device power density increases, there is a need to dissipate generated heat by increasing particle volume loading in thermal interface materials. In this work, we develop and evaluate algorithms for generating ultrapacked microstructures of partic