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pro vyhledávání: '"Sukshitha Achar P L"'
Publikováno v:
International Journal for Numerical Methods in Engineering. 123:1547-1575
Publikováno v:
ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
As device power density increases, there is a need to dissipate generated heat by increasing particle volume loading in thermal interface materials. In this work, we develop and evaluate algorithms for generating ultrapacked microstructures of partic