Zobrazeno 1 - 10
of 105
pro vyhledávání: '"Sujan, D."'
Autor:
Laura Else, Sujan D. Penchala, Azure-Dee Pillay, Thabiso B. Seiphetlo, Limakatso Lebina, Christian Callebaut, Suks Minhas, Roland Morley, Tina Rashid, Neil Martinson, Julie Fox, Saye Khoo, Carolina Herrera
Publikováno v:
Pharmaceutics, Vol 14, Iss 6, p 1285 (2022)
Background: HIV-1 pre-exposure prophylaxis (PrEP) has focused predominantly on protective efficacy in receptive sex, with limited research on the dosing requirements for insertive sex. We pre-clinically assessed the ex vivo pharmacokinetic–pharmaco
Externí odkaz:
https://doaj.org/article/7aa149559dc4428ebae12dd3a114fd4b
Autor:
Else, Laura1 (AUTHOR) l.j.else@liverpool.ac.uk, Penchala, Sujan D.1 (AUTHOR) sujan-kumar.dilly-penchala@liverpool.ac.uk, Pillay, Azure-Dee2 (AUTHOR) tashrico.p@gmail.com, Seiphetlo, Thabiso B.2 (AUTHOR) bridgette.seiphetlo@gmail.com, Lebina, Limakatso3 (AUTHOR) lebinal@phru.co.za, Callebaut, Christian4 (AUTHOR) christian.callebaut@gilead.com, Minhas, Suks5 (AUTHOR) suks.minhas@nhs.net, Morley, Roland5 (AUTHOR) rolandmorley@nhs.net, Rashid, Tina5 (AUTHOR) tina.rashid1@nhs.net, Martinson, Neil3 (AUTHOR) martinson@phru.co.za, Fox, Julie6 (AUTHOR) julie.fox@kcl.ac.uk, Khoo, Saye1 (AUTHOR) khoo@liv.ac.uk, Herrera, Carolina7 (AUTHOR) cherrer1@imperial.ac.uk
Publikováno v:
Pharmaceutics. Jun2022, Vol. 14 Issue 6, p1285-N.PAG. 13p.
Publikováno v:
In Journal of Cleaner Production 15 October 2017 164:1145-1156
Publikováno v:
In Materials and Design January 2015 65:823-830
Publikováno v:
In Materials and Design March 2014 55:410-415
Publikováno v:
In Resources, Conservation & Recycling June 2013 75:14-22
Publikováno v:
MATEC Web of Conferences, Vol 202, p 01005 (2018)
In electronic packaging, typically two or more thin dissimilar plates or layers are bonded together by an extremely thin adhesive bond layer. Electronic assemblies are usually operated under high power conditions which predictably produces a high tem
Externí odkaz:
https://doaj.org/article/9fbf6446aba94bdf8e51c3da5d8c4dca
Publikováno v:
MATEC Web of Conferences, Vol 202, p 01004 (2018)
Thermo-mechanical mismatch stress is one of the reasons for mechanical as well as functional failure between two or more connected devices. In electronic packaging, two or more plates or layers are bonded together by an extremely thin layer. This thi
Externí odkaz:
https://doaj.org/article/d6c17d5d8f9e444b9db827b08807189e
Publikováno v:
MATEC Web of Conferences, Vol 202, p 01006 (2018)
The study of thermal mismatch induced stresses and their role in mechanical failure is one relevant topic to composite materials, photonic devices and electronic packages. Therefore, an understanding of the nature of the interfacial stresses under di
Externí odkaz:
https://doaj.org/article/284e11a109f540c7bc76152a140d0635
Publikováno v:
Polymer Composites. Apr2018, Vol. 39 Issue 4, p1200-1211. 12p.