Zobrazeno 1 - 10
of 63
pro vyhledávání: '"Suibin Luo"'
Publikováno v:
Results in Materials, Vol 23, Iss , Pp 100586- (2024)
Epoxy resin composites are a type of polymer-based materials with wide application scopes. A mass of fillers was added to improve thermal properties which may degrades mechanical properties at the same time. In addition, the common heat-curing proces
Externí odkaz:
https://doaj.org/article/dadfd55bf9e5436c93282e72c3ec74c1
Publikováno v:
High Voltage (2016)
In this study, 2-[2-(2-methoxyethoxy)ethoxy]acetic acid (MEEAA) was used to modify the surface of barium titanate nanoparticles (BT NPs) to enhance the compatibility and dispersion of the BT ceramic fillers in polymer matrix. A uniform coating layer
Externí odkaz:
https://doaj.org/article/afdb6c3d27cc4426adc5890d1339627b
Publikováno v:
Ceramics International. 48:20102-20109
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0ed1af24b66a19c11dee52dcbdd4597
https://doi.org/10.1016/j.ceramint.2022.03.288
https://doi.org/10.1016/j.ceramint.2022.03.288
Publikováno v:
ACS applied materialsinterfaces. 14(45)
Metallized polymer films (MPFs) with superior self-healing properties are extremely attractive for application in energy storage capacitors. Self-healing behaviors allow MPFs to keep insulating between the local electrical breakdown region and the el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8d73510806068069e920acc86e573d3f
https://pubmed.ncbi.nlm.nih.gov/36326237
https://pubmed.ncbi.nlm.nih.gov/36326237
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7c1b7986b4c95fae4124416e4a23ebc
https://doi.org/10.1109/icept56209.2022.9872589
https://doi.org/10.1109/icept56209.2022.9872589
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d81ab025517581d2fdd03a812c562384
https://doi.org/10.1109/icept56209.2022.9873140
https://doi.org/10.1109/icept56209.2022.9873140
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03fdbe7d859def7707e0a9d7fb3dde4f
https://doi.org/10.1109/icept56209.2022.9873526
https://doi.org/10.1109/icept56209.2022.9873526
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88e5d0698fde29edbc6df04bd12e6cd6
https://doi.org/10.1109/icept56209.2022.9873161
https://doi.org/10.1109/icept56209.2022.9873161
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2353e21a5861733dcb077471b5e254b9
https://doi.org/10.2139/ssrn.4185645
https://doi.org/10.2139/ssrn.4185645
Autor:
Jie Liu, Linye Ji, Junyi Yu, Shanjun Ding, Suibin Luo, Baojin Chu, Jianbin Xu, Rong Sun, Shuhui Yu
Publikováno v:
Chemical Engineering Journal. 456:140950
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca45f0d1cbd506a0380b70c07151bf39
https://doi.org/10.1016/j.cej.2022.140950
https://doi.org/10.1016/j.cej.2022.140950