Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Sugimmoto, A."'
Publikováno v:
2008 Electrical Design of Advanced Packaging and Systems Symposium.
Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 ?F in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16fe89e8f193e812250e3e5bb7fbe3b4
https://doi.org/10.1109/edaps.2008.4736002
https://doi.org/10.1109/edaps.2008.4736002
Publikováno v:
2008 Electrical Design of Advanced Packaging & Systems Symposium; 2008, p73-76, 4p