Zobrazeno 1 - 10
of 49
pro vyhledávání: '"Sueo Kawai"'
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 69:766-771
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e05d4dca84c290e0a787326415767ac1
https://doi.org/10.1299/kikaia.69.766
https://doi.org/10.1299/kikaia.69.766
Autor:
Masahiro Suyama, Sueo Kawai
Publikováno v:
Journal of the Society of Mechanical Engineers. 105:127-132
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e06595992e2ff0aaeef18a89ae42ffc
https://doi.org/10.1299/jsmemag.105.1000_127
https://doi.org/10.1299/jsmemag.105.1000_127
Publikováno v:
Journal of Electronic Packaging. 115:9-15
Thermal stress in silicon chips encapsulated in IC plastic packages is discussed. A stress-sensing chip which can detect the three-dimensional stress components separately is developed. Thermal stress occurs in the silicon chip almost linearly with t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5f9f274ce709801ffd614e765a72465
https://doi.org/10.1115/1.2909307
https://doi.org/10.1115/1.2909307
Autor:
Sueo Kawai
Publikováno v:
Journal of the Society of Materials Science, Japan. 42:345-354
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2c79c2d044621c1454e04b7e16b7d10
https://doi.org/10.2472/jsms.42.345
https://doi.org/10.2472/jsms.42.345
Publikováno v:
Materials Science and Engineering: A. 143:247-256
Stresses due to thermal oxidation and film deposition processes during the fabrication of a semiconductor are analysed. The strengths of plastic encapsulants, silicon chips, bonding wires and adhesive interfaces in integrated-circuit (IC) plastic pac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cca20823b98680c77426538b6c1aaf69
https://doi.org/10.1016/0921-5093(91)90744-8
https://doi.org/10.1016/0921-5093(91)90744-8
Publikováno v:
Journal of the Society of Materials Science, Japan. 40:554-560
In plastic packaged integrated circuit (IC) devices, silicon chips are molded with epoxide resins in which silica particles occupy about 60 to 70% of the volume. Recently, the size of chips mounted in a package has increased rapidly with advances in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::878c1be15ee3ced84ee54ed5664189ff
https://doi.org/10.2472/jsms.40.554
https://doi.org/10.2472/jsms.40.554
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 57:1846-1850
Thermal design of plastic IC packages is becoming more important as heat generation of chips increases. Since a large parameter survey is required in the actual design of IC's, numerical analysis such as the finite element method may not always be ap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a75910071517425ee1edbe898623b4f
https://doi.org/10.1299/kikaib.57.1846
https://doi.org/10.1299/kikaib.57.1846
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 57:1575-1580
Thermal stress in silicon chips encapsulated in IC plastic packages was discussed using stress-sensing chips which the authors developed utilizing the piezoresistive effect of silicon. Sensor chips were encapsulated in dual-in-line-type packages usin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::495147e36a25b3796587942adfef2c89
https://doi.org/10.1299/kikaia.57.1575
https://doi.org/10.1299/kikaia.57.1575
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 56:365-371
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ead052318be2e35307668ca8c228f8e6
https://doi.org/10.1299/kikaia.56.365
https://doi.org/10.1299/kikaia.56.365
Publikováno v:
26th Annual Proceedings Reliability Physics Symposium 1988.
Package cracking that occurs in surface-mount devices that have absorbed moisture has been studied by means of a moisture-diffusion analysis of the plastic, deformation and stress analysis of the package, and measurement of some high-temperature prop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::72e76b02f497cd7fc699bb18ab78cb49
https://doi.org/10.1109/relphy.1988.23432
https://doi.org/10.1109/relphy.1988.23432