Zobrazeno 1 - 10
of 72
pro vyhledávání: '"Sudhanva Gurumurthi"'
Autor:
Taekyun Kim, Kyomin Sohn, Sudhanva Gurumurthi, Aaron Nygren, Hoeju Chung, Kijun Lee, Vilas Sridharan, Munseon Jang, Ryu Ye-Sin
Publikováno v:
IEEE Computer Architecture Letters. 20:158-161
HBM3 is the next-generation technology in the JEDEC High Bandwidth Memory™ die-stacked DRAM standard. HBM3 is expected to be widely used in future SoCs to accelerate data center and automotive workloads. Reliability, Availability, and Serviceabilit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e58ea21bdb5dbd1a8f36084f7760d006
https://doi.org/10.1109/lca.2021.3117150
https://doi.org/10.1109/lca.2021.3117150
Autor:
Sudhanva Gurumurthi
Publikováno v:
Proceedings of the 31st International Symposium on High-Performance Parallel and Distributed Computing.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0cf2972c36a2c4d027c00eb03e5a209
https://doi.org/10.1145/3502181.3531456
https://doi.org/10.1145/3502181.3531456
Publikováno v:
2022 IEEE International Reliability Physics Symposium (IRPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f6155c7d0615fd3c3447d71f3fb43ded
https://doi.org/10.1109/irps48227.2022.9764554
https://doi.org/10.1109/irps48227.2022.9764554
Publikováno v:
MICRO
Although emerging Non-Volatile Memories (NVMs) are expected to be adopted in future memory and storage systems, their non-volatility brings complications in designing processors wherein security is an essential requirement. One of these complications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1faf03b3bf8dd6ea6203bc5b65768720
https://doi.org/10.1145/3466752.3480066
https://doi.org/10.1145/3466752.3480066
Publikováno v:
IEEE Computer Architecture Letters. 18:132-135
Die-stacked memories that integrate multiple DRAM dies into the processor package have reduced the interface bottleneck and improved efficiency, but demands for memory capacity and bandwidth remain unfulfilled. Additionally, the introduction of memor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5cdb319c2572f973de8136653f329e77
https://doi.org/10.1109/lca.2019.2941715
https://doi.org/10.1109/lca.2019.2941715
Publikováno v:
IEEE Transactions on Parallel and Distributed Systems. 27:3397-3411
The wide adoption of graphics processing units (GPUs) as accelerators for general-purpose applications makes the end-to-end reliability implications of their use increasingly significant. Fault injection is a widely adopted method to evaluate the res
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3723b984b6341fb60145d3f1fc9d75e9
https://doi.org/10.1109/tpds.2016.2517633
https://doi.org/10.1109/tpds.2016.2517633
Autor:
Sergey Blagodurov, Ada Gavrilovska, Abhinav Vishnu, Thaleia Dimitra Doudali, Sudhanva Gurumurthi
Publikováno v:
HPDC
The increasing demand of big data analytics for more main memory capacity in datacenters and exascale computing environments is driving the integration of heterogeneous memory technologies. The new technologies exhibit vastly greater differences in a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::971128ae212f4b5830a8dc328335e643
https://doi.org/10.1145/3307681.3325398
https://doi.org/10.1145/3307681.3325398
Publikováno v:
MCHPC@SC
With rapid growth in data volumes and an increase in number of CPU/GPU cores per chip, the capacity and bandwidth of main memory can be scaled up to accommodate performance requirements of data-intensive applications. Recent 3D-stacked in-package mem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b45f681e3d07a4d3760165624a78a79
https://doi.org/10.1145/3286475.3286484
https://doi.org/10.1145/3286475.3286484
Autor:
Sudhanva Gurumurthi, Fritz Previlon, David Kaeli, Vilas Sridharan, Mark Wilkening, Steven Raasch
Publikováno v:
DFT
Reliability is a significant design constraint for supercomputers and large-scale data centers. Modeling the effects of faults on applications targeted to such systems allows system architects and software designers to provision resilience features,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5cb5aa67c407f13e1d8fd335c5c6b558
https://doi.org/10.1109/dft.2018.8602987
https://doi.org/10.1109/dft.2018.8602987
Autor:
Bradford M. Beckmann, Nuwan Jayasena, Indrani Paul, Steven K. Reinhardt, Gregory Rodgers, Mike Ignatowski, William C. Brantley, Sudhanva Gurumurthi, Gabriel H. Loh, Michael J. Schulte
Publikováno v:
IEEE Micro. 35:26-36
This article provides an overview of AMD's vision for exascale computing, and in particular, how heterogeneity will play a central role in realizing this vision. Exascale computing requires high levels of performance capabilities while staying within
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9bcceb714faee3f0350cfe740f360110
https://doi.org/10.1109/mm.2015.71
https://doi.org/10.1109/mm.2015.71