Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Subramanya Sadasiva"'
Publikováno v:
Continuum Mechanics and Thermodynamics. 32:987-1010
In this paper, the thermodynamic configurational force associated with a moving interface is used to derive the conditions for phase growth and nucleation in bodies with multiple diffusing species and arbitrary surface stress at the phase interface.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a62b0561e243158fd7d3740ed6cedba
https://doi.org/10.1007/s00161-019-00804-z
https://doi.org/10.1007/s00161-019-00804-z
Publikováno v:
Proceedings. Mathematical, physical, and engineering sciences. 472(2190)
Often during phase growth, the rate of accretion, on the one hand, is determined by a competition between bulk diffusion and surface reaction rate. The morphology of the phase interface, on the other hand, is determined by an interplay between surfac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::9e6b2bddc03e943f4150c5e75a86f9bc
https://pubmed.ncbi.nlm.nih.gov/27436981
https://pubmed.ncbi.nlm.nih.gov/27436981
Autor:
Ganesh Subbarayan, Subramanya Sadasiva
Publikováno v:
Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales.
Diffusion is an important mechanism for failure inducing phenomena in many applications. The common Pb-free solder alloys used in the current generation of electronics packages are complex multiphase multicomponent materials. As the scale of the sold
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::032d5dc4371d71329b63a8d06e6f434c
https://doi.org/10.1115/ipack2015-48655
https://doi.org/10.1115/ipack2015-48655
Publikováno v:
Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences. 472:20160134
Often during phase growth, the rate of accretion, on the one hand, is determined by a competition between bulk diffusion and surface reaction rate. The morphology of the phase interface, on the other hand, is determined by an interplay between surfac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3afd2633096c52b48fd4c9f4d0084544
https://doi.org/10.1098/rspa.2016.0134
https://doi.org/10.1098/rspa.2016.0134
Publikováno v:
Journal of Electronic Packaging. 134
Understanding the effect of high current density on void formation and growth and relating the size of the void to the resulting electrical/mechanical failure is a critical need at the present time to ensure reliable functioning of flip-chip packages
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::648e59e732a05c45ba94af361501f1ca
https://doi.org/10.1115/1.4006707
https://doi.org/10.1115/1.4006707
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1.
Increasing miniaturization has led a significant increase in the current densities seen in flip-chip solder joints. This has made the study of failure in solder joints by void propagation due to electromigration and stress migration more important. I
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26ef2329f0dc844ea9a95b095cef94df
https://doi.org/10.1115/ipack2011-52230
https://doi.org/10.1115/ipack2011-52230