Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Su-juan Zhong"'
Publikováno v:
Journal of Materials Research and Technology, Vol 15, Iss , Pp 3974-3982 (2021)
In this paper, the intermetallic compound (IMC) growth behaviors of Sn/Cu and Sn–0.6SiC/Cu solder under isothermal aging (50, 100, 150, 200 and 250 h) and thermal cycling (300, 600, 900, 1200 and 1500 cycles) were studied. The results manifested th
Externí odkaz:
https://doaj.org/article/5d8e140cc2ec45098026ae787ae75e0c
Publikováno v:
Materials & Design, Vol 215, Iss , Pp 110439- (2022)
During the past decades, series of lead-free solders have been developed rapidly, and are considered as the attractive interconnection materials replacing traditional Sn-Pb solders in electronic industry. In this paper, the interfacial reaction, micr
Externí odkaz:
https://doaj.org/article/de556c3bcfb74354abdb403a92daa6fb
Publikováno v:
Science and Technology of Advanced Materials, Vol 21, Iss 1, Pp 689-711 (2020)
Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare e
Externí odkaz:
https://doaj.org/article/14506c1325be4474a5a46df46d0f8972
Autor:
Liang Zhang, Su-Juan Zhong
Publikováno v:
Frontiers in Materials, Vol 8 (2021)
In this article, the 3D integration with Ni/Sn/Ni joints was conducted using transient liquid phase (TLP) bonding (250°C, 0.2 N) with different bonding time. After TLP bonding, plane-type Ni3Sn4 intermetallic compound (IMC) was observed, and when th
Externí odkaz:
https://doaj.org/article/834c73298c874c8bbd96500f86d4e3a9
Publikováno v:
Materials & Design, Vol 197, Iss , Pp 109224- (2021)
As to promote the performance of the solder joints applied to electronics industry, the researchers take advantage of micro/nano-sized particles or another element coated on nanoparticles to be incorporated into the solder paste or flux and investiga
Externí odkaz:
https://doaj.org/article/f5d8b2a9cb4b4cbc92151e9faf772feb
Publikováno v:
Advances in Materials Science and Engineering, Vol 2016 (2016)
The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elon
Externí odkaz:
https://doaj.org/article/76c4275d18f74e70abaee0516ee53bb5
Publikováno v:
MATERIALS TRANSACTIONS. 63:1375-1379
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30b68794f1eb9a329dddf391b7fc731b
https://doi.org/10.2320/matertrans.mt-m2022061
https://doi.org/10.2320/matertrans.mt-m2022061
Publikováno v:
Journal of Materials Science: Materials in Electronics. 34
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97e543e385f0f1a9e8e730a41934a4ff
https://doi.org/10.1007/s10854-023-10063-z
https://doi.org/10.1007/s10854-023-10063-z
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:7923-7932
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97ab9b53248a576353cfdb108fe9c5cc
https://doi.org/10.1007/s10854-022-07941-3
https://doi.org/10.1007/s10854-022-07941-3
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:18067-18075
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c35a907163465586e7d22c1b6621529
https://doi.org/10.1007/s10854-021-06348-w
https://doi.org/10.1007/s10854-021-06348-w