Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Su-Hwang Kim"'
Publikováno v:
Journal of Korea Foundry Society. 37:31-37
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d31ba0b766877daab045ca5fd84be3d
https://doi.org/10.7777/jkfs.2017.37.2.31
https://doi.org/10.7777/jkfs.2017.37.2.31
Publikováno v:
2008 Asia-Pacific Microwave Conference.
By employing bond-wires connecting the top cover and the PCB ground plane, the shielding effectiveness could be dramatically improved. The packages with a thicker and larger number of bond-wires exhibit better performance. At least 4 bond-wires shoul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da3a8080d1bd25bb33b63a4be7cbada3
https://doi.org/10.1109/apmc.2008.4958653
https://doi.org/10.1109/apmc.2008.4958653