Zobrazeno 1 - 10
of 128
pro vyhledávání: '"Su Wei-Hung"'
Publikováno v:
MATEC Web of Conferences, Vol 123, p 00014 (2017)
With the advance of the semiconductor industry and in response to the demands of ultra-thin products, packaging technology has been continuously developed. Thermal bonding process of copper pillar flip chip packages is a new bonding process in packag
Externí odkaz:
https://doaj.org/article/5733da3685654800a53f811ad6e58443
Autor:
Su Wei-Hung, 蘇威宏
97
The interpretation of exercise experience by the executive of small and medium exterprises Student：Su, Wei-Hung Advisor：Lai, Cheng-Hsiu Abstract This qualitative research aimed the depth interview with four executive of small and medium e
The interpretation of exercise experience by the executive of small and medium exterprises Student：Su, Wei-Hung Advisor：Lai, Cheng-Hsiu Abstract This qualitative research aimed the depth interview with four executive of small and medium e
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/80230174333538536388
Publikováno v:
Proceedings of SPIE; September 2024, Vol. 13140 Issue: 1 p131400K-131400K-4, 1182605p
Publikováno v:
Proceedings of SPIE; September 2024, Vol. 13140 Issue: 1 p131400N-131400N-5, 1182606p
Publikováno v:
Proceedings of SPIE; September 2024, Vol. 13140 Issue: 1 p131400I-131400I-4, 1182605p
Publikováno v:
Proceedings of SPIE; September 2024, Vol. 13140 Issue: 1 p131400L-131400L-4, 1182605p
Publikováno v:
Proceedings of SPIE; September 2024, Vol. 13140 Issue: 1 p131400J-131400J-5, 1182606p
Autor:
Su, Wei-Hung, Co, Wei-Ting
Publikováno v:
In Optics and Lasers in Engineering June 2016 81:11-20
Publikováno v:
Communications on Applied Mathematics and Computation; 20240101, Issue: Preprints p1-16, 16p