Výsledky vyhledávání - "Stray inductances"

Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters

Autor: Roshanghias, Md. Nazmul Hasan, Timothy Polom, Dominik Holzmann, Perla Malagó, Alfred Binder, Ali

Publikováno v: Electronics; Volume 11; Issue 9; Pages: 1373

This paper demonstrates the feasibility of the printed copper (Cu) paste interconnects for applications in power semiconductor modules and switching converters. Copper sinter paste interconnects denoted as “Sinterconnects” have been recently intr

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=multidiscipl::ca05447a2fc547daec9d03241254aa68

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Akademický článek

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Dissertation/ Thesis

Design of Resonant Converters using Silicon Carbide Power

Autor: Moozhikkal, Rahul

The design of series-loaded resonant converters using the state of the art SiC power transistorsis investigated in the thesis. SiC devices are chosen as they offer lower switching losses comparedto conventional Si based devices A very detailed study

Externí odkaz: http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-201662

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Analysis of the three-chip switching cells approach for integrated multi-phase power converter combining monolithic and hybrid techniques: Experimental validation on SiC and Si power assembly prototypes

Autor: Adem Lale, Nicolas Videau, Frédéric Richardeau, Abdelhakim Bourennane, Samuel Charlot

Publikováno v: Power Electronics and Applications (EPE'15 ECCE-Europe), 2015 17th European Conference on.
Power Electronics and Applications (EPE'15 ECCE-Europe), 2015 17th European Conference on., Sep 2015, Genève, Switzerland. ⟨10.1109/EPE.2015.7311711⟩

International audience; In this paper, the authors present a novel integration approach for multi-phase IGBT module, based on both monolithic and hybrid integration methods. In this proposed “3-chip” approach, the discrete switches are integrated

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6fa160de3d7a5b8f0f377014eea75bbb
https://hal.archives-ouvertes.fr/hal-01230267

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Conference

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Integrated dc-dc based-GaN converter with screen printed capacitors allowing double side cooling

Autor: Thierry Lebey, Olivier Goualard, Nicolas Videau, Thierry Meynard, Emmanuel Sarraute, Vincent Bley, Thi Bang Doan

Publikováno v: IECON

Converter topology, power devices, passives elements and technology are the keys elements to achieve highly efficient and integrated converters. This article discusses each of these items with a point of load converter application in mind. The potent

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6c223a466fec560cf08c0c464cd17638
https://doi.org/10.1109/iecon.2014.7048708

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5-phase interleaved buck converter with gallium nitride transistors

Autor: Nicolas Videau, Thierry Meynard, Julio Brandelero, Vincent Bley, Didier Flumian, Guillaume Fontes, Emmanuel Sarraute

Publikováno v: WiPDA : IEEE Workshop on Wide Bandgap Power Devices and Applications, Oct. 27-29, 2013, Columbus, OH (USA)
WiPDA : IEEE Workshop on Wide Bandgap Power Devices and Applications, Oct. 27-29, 2013, Columbus, OH (USA), Oct 2013, Columbus, United States. pp.190-193, ⟨10.1109/WiPDA.2013.6695594⟩

International audience; More compact power converters can be realized with the recently introduced gallium nitride (GaN) power devices. However, power board layout becomes more critical. In order to reduce switching losses, voltage overshoot and to a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e39f0c66a3f1df2f6494990d039a0094
https://hal.science/hal-03891967

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