Zobrazeno 1 - 10
of 40
pro vyhledávání: '"Steven Yun"'
Publikováno v:
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI).
A novel fast power integrity design approach has been implemented and deployed with SPIM and UPIT, to efficiently address customers' platform design differentiation for PDN design & optimization with trade-off, and review & sign off.
Publikováno v:
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC).
Scalable platform power integrity design approach is first time developed, together with standard PI model (SPIM) and unified PI target (UPIT) to efficiently address HVM customers' largely design differentiation with power delivery network design & o
Publikováno v:
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
An efficient and effective methodology for platform power delivery and power integrity (PD-PI) co-analysis and design optimization has been developed, for investigating high yield loss, to support SoC validation. Both frequency and time domain result
Autor:
Laura Brosh, Bruce L. Dalkin, Kate E. Smith, Dea Nagy, Connie Cortez, Amit M. Algotar, Ubaradka Sathyanarayana, Raymond B. Nagle, Janice Riley, Carol Jones, Ryan Dittamore, Gary Pestano, Steven Yun
Publikováno v:
The Prostate. 73:1233-1240
BACKGROUND This study examines the combined effect of two common genetic alterations, ERG and PTEN, in prostate carcinoma progression. METHODS Prostate tissue from 90 patients having unilateral capsular penetrating lesions, and a contra-lateral organ
Publikováno v:
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).
Signal margin oriented SIPI analytical synthesis methodology is developed for PI design with concurrence of SI design based upon PDA for LPDDR interfaces. The SIPI analytical synthesis results are well correlated with empirical Spice simulation resul
Publikováno v:
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS).
Modern mobile platforms contain mainly active components in a small area with stringent power and cost targets. An integrated clock is needed for PLLs, component internal functions as well as transferring data among them. Due to the small mobile form
Publikováno v:
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC).
High-speed IO performance verification is challenging due to system variations across high volume manufacturing. This paper presents a methodology to quantify variations caused by several IO subcomponents including transmitter, receiver, channel, tes
Autor:
Steven Yun Ji, Kinger Xingjian Cai
Publikováno v:
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC).
The total DDR on-die AC power delivery noise can be decomposed into high pass filtered (HPF) Vppa and low pass filtered (LPF) Vppb. PI-SI co-simulation reveals that Vppa impacts timing (eye width) and Vppb impacts signal voltage amplitude (eye height
Autor:
Kinger Xingjian Cai, Steven Yun Ji
Publikováno v:
2015 IEEE 19th Workshop on Signal and Power Integrity (SPI).
A scalable power delivery analysis methodology is described for SoCs targeted at cost-driven platforms. The methodology is applied at different design stages to consolidate a hundred independent power supplies at bump level to half that at solder bal
Publikováno v:
The Journal of Physical Chemistry B. 107:435-442
Continuous-wave photoluminescence studies on CdSe nanocrystals assembled with oligo-p-(phenylene-ethynylene)n-dibenzylthiols (n = 0,1,3) indicate long-range resonant energy transfer can be tuned by size-dependent control of the weak electromagnetic d