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pro vyhledávání: '"Steven Lee Hou Jang"'
Autor:
Steven Lee Hou Jang
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Amorphous silicon (a-Si:H) thin films with deposition temperatures ranging from 100°C to 400°C from two different deposition chambers have been analyzed and characterized using various techniques including the Atomic Force Microscope (AFM). These a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9b879bd12572b97cd98cfee0dc04cd2
https://doi.org/10.1109/eptc.2018.8654352
https://doi.org/10.1109/eptc.2018.8654352
Autor:
Loh Woon Leng, Ding Liang, Hong Seong Sohn, Tan Kuam Hua, Hua Mao Lin, Steven Lee Hou Jang, John Tracy
Publikováno v:
Solid State Phenomena. 219:225-229
A new generation of negative tone and chemically amplified positive tone photoresists by TOK, JSR, Dow Chemical and others has gained momentum for advanced packaging applications. Resist thickness requirements are increasing to the 40-100 μm range a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6eab5165e389bafb64070b4bf4854ece
https://doi.org/10.4028/www.scientific.net/ssp.219.225
https://doi.org/10.4028/www.scientific.net/ssp.219.225
Autor:
Jae Woong Choi, Ramana Murthy, Gil Ho Hwang, Steven Lee Hou Jang, Soon Wook Kim, Hongyu Li, Eugene Tan Swee Kiat, Lee Guan Ong
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 3:1820-1825
In this paper, we developed an isotropic wet etching process in a capsule-type bevel etch chamber to reduce a Cu overburden of through Si via (TSV) for less wafer-level warpage with 300 mm wafers. We report the relationship between the wafer-level wa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06187fa08fa4ad8619d3bf76db12ac3e
https://doi.org/10.1109/tcpmt.2013.2279265
https://doi.org/10.1109/tcpmt.2013.2279265
Publikováno v:
Advanced Materials Research. 254:54-57
Various types of polyimide have been used widely in the manufacturing of integrated circuits and MEMS’ (Micro Electrical Mechanical Systems) such as sensors. These organic spin-on polymers exhibit a wide range of mechanical and electrical propertie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9e412e32fc40d8f15eebb72296e0640
https://doi.org/10.4028/www.scientific.net/amr.254.54
https://doi.org/10.4028/www.scientific.net/amr.254.54
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC); 2014, p762-767, 6p