Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Steven Labovitz"'
Publikováno v:
Photomask Technology 2008.
reporting the use of high sensitivity DUV transmission metrology as a means for detection of progressive transmission loss on mask and pellicle surfaces. We also report a use case for incoming reticle qualification based on DUV transmission uniformit
Publikováno v:
SPIE Proceedings.
A key feature of a photomask is the transmission (Tr) property of its many surfaces. Typical advanced 6" masks have 4 surfaces: back side Quartz (Qz), Front side pattern, inside pellicle and outside pellicle. In addition to the surfaces themselves th
Autor:
Eitan Zait, Vladimir Dmitriev, Guy Ben-Zvi, Erez Graitzer, Robert Birkner, Steven Labovitz, Klaus Böhm, Thomas Scheruebl
Publikováno v:
SPIE Proceedings.
It has been previously demonstrated that wafer CD uniformity can be improved via an ultrafast laser system. The system provides local CD Control (CDC) by writing inside the bulk of photomasks. Intra-field CD variation correction has been implemented
Publikováno v:
SPIE Proceedings.
Advanced wafer fabs are currently fabricating devices with 90nm and 65nm design rules using 193nm lithography. To meet the challenges at these sub-wavelength technology nodes, mask designers are using a variety of resolution enhancement techniques (R
Autor:
Ken Mr. Buckmann, Long He, Marilyn Kamna, Steven Labovitz, Michael Kovalchick, Qi-De Qian, Jeff Farnsworth, Wen-Hao Cheng, Yulia Korobko, Wilman Tsai, Brian Irvine, R. Talevi
Publikováno v:
SPIE Proceedings.
Alternating Phase Shift Mask (APSM) reticles is critical to achieve sub 0.1 um poly gate lithography. Intrinsic APSM image inbalance can be resolved with various methods such as isotropic etch and aperture sizing, where positional line-shift can be r
Autor:
Steven Labovitz
Publikováno v:
WRPMD'99.
Autor:
Jeff Farnsworth, Scott Chegwidden, Giang T. Dao, Frederick T. Chen, Wilman Tsai, Marilyn Kamna, Steven Labovitz
Publikováno v:
SPIE Proceedings.
Fabrication of 0.18 micrometers generation clearfield logic device photomask with plasma etch was compared with wet etch method in current 0.25 micrometers mask technology. Spatial consistency between the resist develop and plasma etch modules was cr