Zobrazeno 1 - 10
of 124
pro vyhledávání: '"Steven L. Wright"'
Autor:
Carrie M. Silvernail, Steven L. Wright
Publikováno v:
Advances in Therapy. 39:1871-1880
Although benzodiazepines have been used for 6 decades, many questions remain unanswered by research. The lived experiences of those adversely affected long term can provide insights into how these agents might be more thoughtfully prescribed. Here, p
Autor:
Bucknell C. Webb, Agno Marlon, Steven L. Wright, Katsuyuki Sakuma, Jiamin Ni, Ken Latzko, Xiao Hu Liu, John U. Knickerbocker, James A. Tornello, Stephen W. Bedell, Paul A. Lauro, Huan Hu
Publikováno v:
IEEE Sensors Journal. 19:7868-7874
Wearable sensors can provide important human physiology and activity data and therefore have promising applications in healthcare, entertainment, and security. Here, we report the design, fabrication, and characterizations of a thin silicon film sens
Autor:
John F. Peppin, Steven L. Wright
Publikováno v:
The Benzodiazepines Crisis
Chronic pain is widespread and the use of opioids for chronic pain is also common. Frequently benzodiazepines are concomitantly prescribed in these patients, for anxiety, sleep disorders, and muscle pain and spasm. In the United States, Canada, and t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0578996dff2e040fa2657a23ce97fdec
https://doi.org/10.1093/med/9780197517277.003.0009
https://doi.org/10.1093/med/9780197517277.003.0009
Autor:
Steven L. Wright
Publikováno v:
The Benzodiazepines Crisis
Benzodiazepines and related compounds (benzodiazepine receptor agonists [BzRAs]) cause a wide range of adverse reactions, including withdrawal symptoms, even when normal or low dosages are used. Deprescribing is recommended when there is loss of effi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa19be7086d23b634cbfc1a90b09118d
https://doi.org/10.1093/med/9780197517277.003.0008
https://doi.org/10.1093/med/9780197517277.003.0008
The authors summarize the harmful and understudied aspects of the overuse of benzodiazepines. Increased and longer-term use of benzodiazepines has been observed to lead to side effects such as sedation, cognitive issues, abuse, and dependence, as wel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52a4584883b31c37d795128f6bf655ae
https://doi.org/10.1093/med/9780197517277.003.0014
https://doi.org/10.1093/med/9780197517277.003.0014
Autor:
Steven L. Wright, Serena Y. Kim, William L. Swann, Sojeong Kim, Megan Lamiotte, Alex Osei-Kojo, Mark W. Davis, Terri L. Schreiber
Publikováno v:
Journal of Public Health Management and Practice.
CONTEXT Despite attention to federal and state governments' response to the US opioid crisis, few studies have systematically examined local governments' role in tackling this problem. OBJECTIVES To determine what opioid policy and programmatic activ
Publikováno v:
Electronic Imaging. 28:1-10
Autor:
John U. Knickerbocker, Agno Marlon, Huan Hu, Stephen W. Bedell, Steven L. Wright, Katsuyuki Sakuma, Bucknell C. Webb, Ken Latzko
Publikováno v:
2018 International Flexible Electronics Technology Conference (IFETC).
In this research study, we present comprehensive characterizations of flexible silicon sensors fabricated using controlled spalling which uses fracture to produce thin films of single-crystal silicon directly from a bulk substrate. We characterized t
Autor:
A. M. Stephens, P.S. Andry, R. Horton, Sri M. Sri-Jayantha, Steven L. Wright, Katsuyuki Sakuma, Cornelia K. Tsang, Mario J. Interrante, John U. Knickerbocker, B. C. Webb, Edmund J. Sprogis, Chirag S. Patel, R. Sirdeshmukh, Anna W. Topol, B. Dang, Robert J. Polastre
Publikováno v:
IBM Journal of Research and Development. 52:553-569
Three-dimensional (3D) silicon integration of active devices with through-silicon vias (TSVs), thinned silicon, and silicon-to-silicon fine-pitch interconnections offers many product benefits. Advantages of these emerging 3D silicon integration techn
Autor:
J. Zheng, B. C. Webb, Steven L. Wright, Katsuyuki Sakuma, Edmund J. Sprogis, B. Dang, Robert J. Polastre, John U. Knickerbocker, P.S. Andry, R. Horton, Chirag S. Patel, Mario J. Interrante, Cornelia K. Tsang, Arun Sharma
Publikováno v:
IBM Journal of Research and Development. 52:599-609
Three-dimensional (3D) integration technology promises to continue enhancing integrated-circuit system performance with high bandwidth, low latency, low power, and a small form factor for a variety of applications. In this work, conventional C4 (cont