Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Steven G. Rosser"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000618-000634
The demand for high-performance, lightweight, portable computing power is driving the industry toward 3D integration to meet the demands of higher functionality in ever smaller packages. To accomplish this, new packaging needs to be able to integrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db206e81d03cc0c502087120328ac620
https://doi.org/10.4071/2013dpc-tp12
https://doi.org/10.4071/2013dpc-tp12
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001963-001976
The wide range of applications for medical electronics drives unique requirements that can differ significantly from commercial & military electronics. To accomplish this, new packaging structures need to be able to integrate more dies with greater f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87949affb71295720d969b07b96b7a58
https://doi.org/10.4071/2013dpc-tha24
https://doi.org/10.4071/2013dpc-tha24
Publikováno v:
International Symposium on Microelectronics. 2013:000531-000537
The demand for high-performance, lightweight, portable computing power is driving the industry toward 3D integration to meet the demands of higher functionality in ever smaller packages. To accomplish this, new packaging needs to be able to integrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e1049e42db5424ca9ae4970a68fca4ec
https://doi.org/10.4071/isom-2013-wa43
https://doi.org/10.4071/isom-2013-wa43
Autor:
V. Markovich, Steven G. Rosser, William Wilson, Mark Schadt, Rabindra N. Das, Frank Egitto, Timothy Antesberger
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001876-001897
Greater I/O density at the die level, more demanding performance requirements, and the continued desire to package more function into smaller devices is driving the need for improved wiring density and a concomitant reduction in feature sizes for ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5d88f01326a4ea7f7e1b616ef7cdc6f
https://doi.org/10.4071/2011dpc-wp35
https://doi.org/10.4071/2011dpc-wp35
Publikováno v:
International Symposium on Microelectronics. 2010:000847-000854
This paper discusses thin film technology based on barium titanate (BaTiO3)-epoxy polymer nanocomposites. In particular, we highlight recent developments on high capacitance, large area, thin film passives and their integration in System in a Package
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01c34f219b60289c6c9565a51a2b79f0
https://doi.org/10.4071/isom-2010-tha3-paper4
https://doi.org/10.4071/isom-2010-tha3-paper4
Autor:
Rabindra N. Das, Tim Antesberger, Voya R. Markovich, Konstantinos I. Papathomas, Steven G. Rosser
Publikováno v:
Circuit World. 35:31-39
PurposeEmbedded passives account for a very large part of today's electronic assemblies. This is particularly true for products such as cellular phones, camcorders, computers, and several critical defence devices. Market pressures for new products wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::feaf7cab3641cb09ae795cf19f18b226
https://doi.org/10.1108/03056120911002398
https://doi.org/10.1108/03056120911002398
Autor:
Robert Welte, Voya R. Markovich, Rabindra N. Das, Richard Kelly, Steven G. Rosser, Mark D. Poliks, John M. Lauffer
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
This paper presents fabrication and electrical characterization of embedded actives and passives in organic multilayered substrates. We have designed and fabricated several test vehicles focusing on embedded actives and passives. Test vehicles with t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b25d7bfd45332520ac5402980a8fe41
https://doi.org/10.1109/ectc.2012.6249049
https://doi.org/10.1109/ectc.2012.6249049
Autor:
John M. Lauffer, Rabindra N. Das, Voya R. Markovich, Mark D. Poliks, Tim Antesberger, Konstantinos I. Papathomas, Steven G. Rosser
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Embedded passives account for a very large part of today's electronic assemblies. This is particularly true for products such as cellular phones, camcorders, computers and several critical defense devices. Market pressures for new products with more
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::693bbfe7689f72cfeca6f966ecd68f7c
https://doi.org/10.1109/ectc.2009.5074073
https://doi.org/10.1109/ectc.2009.5074073
Autor:
Kostas I. Papathomas, Rabindra N. Das, Steven G. Rosser, Mark D. Poliks, Voya R. Markovich, John M. Lauffer
Publikováno v:
2008 58th Electronic Components and Technology Conference.
This paper discusses thin film technology based on resin coated copper capacitive (RC3) nanocomposites. In particular, we highlight recent developments on high capacitance, large area, thin film passives, their integration in printed wiring boards (P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce277270332266f2b3158bee53c59476
https://doi.org/10.1109/ectc.2008.4550054
https://doi.org/10.1109/ectc.2008.4550054
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Greater I/O density at the die level, coupled with more demanding performance requirements, is driving the need for improved wiring density and a concomitant reduction in feature sizes for electronic packages. Traditionally, greater wiring densities
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92a762f3a5eeef71087896e3ffa58740
https://doi.org/10.1109/ectc.2005.1441415
https://doi.org/10.1109/ectc.2005.1441415