Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Steven B. Herschbein"'
Publikováno v:
International Symposium for Testing and Failure Analysis.
The design and construction of a well-executed laboratory space to house high resolution analytical imaging and processing tools can often be more complex and expensive than anticipated. Unlike their manufacturing counterparts, lab tools as a class h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::988cd7e727a20bd91ceb162002af49ee
https://doi.org/10.31399/asm.cp.istfa2022p0240
https://doi.org/10.31399/asm.cp.istfa2022p0240
Autor:
Edward S. Hermann, John Carulli, Carmelo F. Scrudato, Steven B. Herschbein, Kyle M. Winter, Brian Yates
Publikováno v:
International Symposium for Testing and Failure Analysis.
Focused Ion Beam (FIB) chip circuit editing is a well-established highly specialized laboratory technique for making direct changes to the functionality of integrated circuits. A precisely tuned and placed ion beam in conjunction with process gases s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4393088a11014e675c6da4e7ad89a1bf
https://doi.org/10.31399/asm.cp.istfa2020p0122
https://doi.org/10.31399/asm.cp.istfa2020p0122
Publikováno v:
International Symposium for Testing and Failure Analysis.
Focused Ion Beam (FIB) circuit edit allows for rapid prototyping of potential semiconductor design changes without the need to run a full manufacturing cycle in a semiconductor Fab. By FIB editing a completed module, thorough testing on the bench or
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47c830415e7ec74bb60db28561c3363c
https://doi.org/10.31399/asm.cp.istfa2019p0204
https://doi.org/10.31399/asm.cp.istfa2019p0204
Publikováno v:
International Symposium for Testing and Failure Analysis.
The Focused Ion Beam (FIB) technique of internal modification for chip repair, layout verification, and internal signal probe access has become an integral part of the process for bringing advanced products to market. The pervasive switch from wire b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bcbb9cc4d979b01f586b42574fe8ff3c
https://doi.org/10.31399/asm.cp.istfa2013p0123
https://doi.org/10.31399/asm.cp.istfa2013p0123
Publikováno v:
International Symposium for Testing and Failure Analysis.
For most advanced semiconductor products, Focused Ion Beam (FIB) circuit modification and node access through the backside of the chip is the only viable approach. The high density of interconnect wiring and the presence of C4 solder bumping for chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15c373d29038e25a111bfcac565d126a
https://doi.org/10.31399/asm.cp.istfa2011p0031
https://doi.org/10.31399/asm.cp.istfa2011p0031
Autor:
Bing Dai, Harvey E. Berman, Steven B. Herschbein, Hyoung H. Kang, Carmelo F. Scrudato, Aaron D. Shore
Publikováno v:
International Symposium for Testing and Failure Analysis.
The presence of a full wafer dual-beam FIB on the process floor gave rise to an environment in which formerly segregated off-line lab and FAB tasks could be linked. One such idea involved a methodology for semi-automated defect targeting based on the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b79ac28d9a5018506df9ad344f9ce9ff
https://doi.org/10.31399/asm.cp.istfa2010p0113
https://doi.org/10.31399/asm.cp.istfa2010p0113
Autor:
Oliver D. Patterson, Steven B. Herschbein, James P. Nadeau, John F. King, Scott Edward Fuller, Hyoung H. Kang
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper introduces a high volume and fast turnaround TEM sample preparation method and requirements for a 300 mm inline DualBeam (FIB/SEM) system with “hands-off” full automation. It requires a factory automation system, robust automated recip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::190229619f16e5131b8ed2afc2ff8d82
https://doi.org/10.31399/asm.cp.istfa2010p0102
https://doi.org/10.31399/asm.cp.istfa2010p0102
Autor:
Corey Senowitz, Hyoung H. Kang, Michael A. Gribelyuk, Oliver D. Patterson, Steven B. Herschbein
Publikováno v:
International Symposium for Testing and Failure Analysis.
Cross-sectional style transmission electron microscopy (TEM) sample preparation techniques by DualBeam (SEM/FIB) systems are widely used in both laboratory and manufacturing lines with either in-situ or ex-situ lift out methods. By contrast, however,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36e4a52514dd24dc44479594541a4a07
https://doi.org/10.31399/asm.cp.istfa2008p0168
https://doi.org/10.31399/asm.cp.istfa2008p0168
Publikováno v:
International Symposium for Testing and Failure Analysis.
Test engineers and failure analyst familiar with random access memory arrays have probably encountered the frustration of dealing with address descrambling. The resulting nonsequential internal bit cell counting scheme often means that the location o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb41aab8db5ba25ee8ee533542bf6f01
https://doi.org/10.31399/asm.cp.istfa2008p0128
https://doi.org/10.31399/asm.cp.istfa2008p0128
Publikováno v:
International Symposium for Testing and Failure Analysis.
The sample preparation required for a typical backside circuit edit (CE) is a significant barrier for some labs, as it requires specific hardware and considerable operator expertise. There are also instances in which it is not possible to mechanicall
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab42a6ab9115387760c46e4fd30d1434
https://doi.org/10.31399/asm.cp.istfa2008p0141
https://doi.org/10.31399/asm.cp.istfa2008p0141