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Autor:
Karl J. Puttlitz, Paul A. Lauro, Donald W. Henderson, Timothy A. Gosselin, Da-Yuan Shih, Jay Bartelo, Won Kyoung Choi, Sung K. Kang, Tae K. Hwang, Steve R. Cain, Charles C. Goldsmith
Publikováno v:
MATERIALS TRANSACTIONS. 45:695-702
The electronic industry is making substantial progress toward a full transition to Pb-free soldering in the near future. At present, the leading candidate Pb-free solders are near-ternary eutectic Sn-Ag-Cu alloys. The electronic industry has begun to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::546053c8613327b41424d196ea8a1cd2
https://doi.org/10.2320/matertrans.45.695
https://doi.org/10.2320/matertrans.45.695
