Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Steve Heineke"'
Autor:
Sam Subramanian, Jose Z. Garcia, Nelson Gomez, Steve Heineke, Kent Erington, Kris Dickson, Stefano Larentis, Khiem Ly, Tony Chrastecky
Publikováno v:
International Symposium for Testing and Failure Analysis.
As advanced silicon-on-insulator (SOI) technology becomes a more widespread technology offering, failure analysis approaches should be adapted to new device structures. We review two nanoprobing case studies of advanced SOI technology, detailing the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4a25d2b74bec3f2117ba7a05d5393fd
https://doi.org/10.31399/asm.cp.istfa2019p0381
https://doi.org/10.31399/asm.cp.istfa2019p0381
Publikováno v:
Proceedings of the 53rd Electronic Components & Technology Conference, 2003; 2003, p1334-1343, 10p
Publikováno v:
2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p997-1002, 6p
Autor:
ASM Interational
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip d
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Autor:
P. Singh, Puligandla Viswanadham
Those of us who grew up in the'through-hole'age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems al