Zobrazeno 1 - 10
of 37
pro vyhledávání: '"Steve Chiu"'
Publikováno v:
International Journal of Civil Engineering. 20:337-348
This paper presents a new volume-occupancy-based actuated signal control system for a diamond interchange, where a two-way arterial street intersects two one-way streets on each side of a freeway, aiming to approximately capture vehicle platoons and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de82609e34d49fa09f46a793e50a7e8a
https://doi.org/10.1007/s40999-021-00666-0
https://doi.org/10.1007/s40999-021-00666-0
Autor:
Terry Wang, Heng-Yin Chen, Steve Chiu, Shau-Fei Cheng, Cheng-Chung Lee, Frank Yang, Hsin-Cheng Lai
Publikováno v:
SID Symposium Digest of Technical Papers. 52:772-776
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::814a0c4dc51317196bb0baabc9c76f27
https://doi.org/10.1002/sdtp.14797
https://doi.org/10.1002/sdtp.14797
Publikováno v:
IET Intelligent Transport Systems. 14:127-137
A signal control method considering platoon-based actuation is presented with a focus on its application to two arterial corridors in the Houston Metropolitan Area, where the signal coordination is required for adjacent intersections. For the purpose
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6d607860824b1703a3861e382e65b98
https://doi.org/10.1049/iet-its.2019.0289
https://doi.org/10.1049/iet-its.2019.0289
Autor:
Liang-Cyuan Chang, Jui-Wen Yang, Yuh-Zheng Lee, Tzu-Hao Yu, Shao-An Yan, Hsin-Cheng Lai, Steve Chiu, Yu-Hua Chung, Chieh-Wei Feng, Terry Wang
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
This study realized a functional RDL structure in FOPLP for the first time. It shows not only the potentials and advantages of small generation display factory to produce IC packaging by FOPLP in the future, but also a new concept of hetero-integrati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f388c90003f522752361abc67be9c54
https://doi.org/10.1109/ectc32862.2020.00017
https://doi.org/10.1109/ectc32862.2020.00017
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Fan-out wafer/panel level package (FOWLP/ FOPLP) technology has been demonstrated widely in wearable electronics and flexible hybrid electronics (FHE). Previously, electromigration (EM) mainly has been discussed on the related FOWLP/FOPLP interconnec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::015cf8813c5d0982556f9c5a650c119f
https://doi.org/10.1109/ectc32862.2020.00289
https://doi.org/10.1109/ectc32862.2020.00289
Publikováno v:
Processes, Vol 9, Iss 2194, p 2194 (2021)
Processes; Volume 9; Issue 12; Pages: 2194
Processes; Volume 9; Issue 12; Pages: 2194
In this study, three single-chamber microbial fuel cells (MFCs), each having Pt-coated carbon cloth as a cathode and four bamboo charcoal (BC) plates as an anode, were run in a fed-batch mode, individually and in series. Simulated potato-processing w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9113c064b173921ac5570fc8a95cf17a
https://doi.org/10.3390/pr9122194
https://doi.org/10.3390/pr9122194
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
There are many portable electronic products made by fan-out wafer/panel level package (FOWLP/FOPLP). The redistribution layer(RDL) design with fine pitch to connect inter each application is used. However, the above packaging products usually face th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d24dd7900d786e8d024c13fa1666429f
https://doi.org/10.1109/ectc.2019.00308
https://doi.org/10.1109/ectc.2019.00308
Autor:
Terren Lu, Stephen Tseng, Myongseob Kim, J. Y. Lai, Liam Madden, Woon-Seong Kwon, Suresh Ramalingam, Jonathan Chang, Genie Tsai, Steve Chiu
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 12:67-71
Technology challenges and solutions in the development and manufacturing of stacked silicon interconnect (SSI) technology have been investigated with the established foundry and outsourced semiconductor assembly and test ecosystem. Key enabling techn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b59146d9830329d5e8cd22ac10d984a
https://doi.org/10.4071/imaps.453
https://doi.org/10.4071/imaps.453
Autor:
Stephen Chen, Chunzi Huang, Steve Chiu, Hung-Hsien Chang, Liam Madden, Chi-Hsin Chiu, Xin Wu, Suresh Ramalingam, Woon-Seong Kwon
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 12:111-117
This article introduces the first comprehensive demonstration of new innovative technology comprising multiple key technologies for highly cost-effective and high-performance Xilinx field programmable gate array (FPGA), which is so-called stack silic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c8f917de47442fbb43b55cb5fdac8e14
https://doi.org/10.4071/imaps.452
https://doi.org/10.4071/imaps.452