Výsledky vyhledávání - "Sterken, Tom"

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Periodical

Development of a Stretchable Circuit and its Integration Method on Knit Fabrics for Lower Back Injury Prevention

Autor: Veske, Paula, Bauwens, Pieter, Bossuyt, Frederick, Sterken, Tom, Schuermans, Joke, Vanfleteren, Jan

Publikováno v: Journal of Biomimetics, Biomaterials and Biomedical Engineering; July 2022, Vol. 57 Issue: 1 p17-26, 10p

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Adhesion test for UTCP structure in humid environment

Autor: Kokko, Kati, Sterken, Tom, Vermeiren, Filip, Vanfleteren, Jan

Publikováno v: IMAPS Nordic 2013, Abstracts

Ultra-Thin Chip Packaging (UTCP) technology enables the integration of off-the-shelf integrated circuits into thin substrates such as different kinds of circuit boards. This technology has been created at CMST during many years of intensive study. In

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______330::82a40a2341c83fee5033843b436b27d3
https://biblio.ugent.be/publication/4217587/file/4227657

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Low power wireless sensor network for structural health monitoring of buildings using MEMS strain sensors and accelerometers

Autor: Torfs, Tom, Sterken, Tom, Brebels, Steven, Santana-Corte, Juan, Van den Hoven, Richard, Saillen, Nicolas, Bertsch, Nicolas, Trapani, Davide, Zonta, Daniele

Publikováno v: 2nd MEMSCON workshop : towards intelligent civil infrastructure, Proceedings

Within the MEMSCON project, a wireless sensor network was developed for structural health monitoring of buildings to assess earthquake damage. The sensor modules use custom-developed capacitive MEMS strain and 3D acceleration sensors and a low power

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______330::e32a2523e370e01dde76e12801689002
https://biblio.ugent.be/publication/2104866/file/2104914

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High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Autor: Sterken, Tom, Op de Beeck, Maaike, Vermeiren, Filip, Torfs, Tom, Wang, Liang, Priyabadini, Swarnakamal, Dhaenens, Kristof, Cuypers, Dieter, Vanfleteren, Jan

Publikováno v: IMAPS 2012 : proceedings of the 45th international symposium on microelectronics

Thinning down ICs is a well-known approach to reduce the volume of chip packages. In this work ICs are thinned down to 30um, followed by a package procedure in polyimide with copper fan out, which allows their embedding in adhesives used for laminati

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______330::f3509c48e6c7e5e42082dade0dae83ce
https://hdl.handle.net/1854/LU-3169473

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Full-scale laboratory validation of a MEMS-based technology for post-earthquake damage assessment

Autor: Trapani, D, Zonta, D, Molinari, M, Amditis, A, Bimpas, M, Bertsch, N, Spiering, V, Santana, J, Sterken, Tom, Torfs, T, Bairaktaris, D, Bairaktarisg, M, Camarinopulos, S, Frondistou-Yannas, M, Ulieru, D

Publikováno v: Earthquake Engineering, 15th World conference, Proceedings

In this work a new generation of long-term monitoring system, named Memscon, is presented. The Memscon system consists of a set of sensor nodes using custom-developed capacitive MEMS strain and acceleration sensors, a low power wireless network archi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______330::f16325ba8cbf049ca521e9967348a161
https://biblio.ugent.be/publication/4296285/file/4296336

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Low power wireless sensor network for building monitoring

Autor: Torfs, Tom, Sterken, Tom, Brebels, Steven, Santana-Corte, Juan, van den Hoven, Richard, Van Hoof, Chris, Saillen, Nicolas, Bertsch, Nicolas, Trapani, Davide, Zonta, Daniele, Marmara, Paris, Bimpas, Matthaois

Publikováno v: IEEE Sensors, Papers

A wireless sensor network is proposed for monitoring buildings to assess earthquake damage. The sensor nodes use custom-developed capacitive MEMS strain and 3D acceleration sensors and a low power readout ASIC for a battery life of up to 12 years. Th

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______330::382f4b4f00169509dfe6433da12bbccd
https://hdl.handle.net/1854/LU-3142264

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