Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Stephen Tisdale"'
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
For the electronics and semiconductor industries, as well as for suppliers in the chemical industry where new, complex material development has a key role in advancing the next technology innovations, a proactive approach to addressing Environmental,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40489bf252c9bf0b6142156a85411283
https://doi.org/10.1109/icep.2016.7486791
https://doi.org/10.1109/icep.2016.7486791
Autor:
Elizabeth Benedetto, Gregory Henshall, Julie Silk, Joelle Arnold, Stephen Tisdale, Fay Hua, Richard D. Parker, Keith Sweatman, Michael Osterman, Aileen M. Allen, Jennifer Nguyen, Polina Snugovsky, Jian Miremadi, Ursula Marquez de Tino, Graver Chang, Ahmer Syed, Keith Howell, Tae-Kyu Lee, Derek Daily, Bill F Jones, Mark Currie, Ranjit S. Pandher, Weiping Liu, Donald J Moore, Thilo Sack, Joe Smetana, Richard J. Coyle
Publikováno v:
2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
Significant innovations in Pb-free solder alloy formulations are being driven by volume manufacturing and field experiences. As a result, the industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d48f9759085ab152fef224af8fdc172
https://doi.org/10.1109/iemt.2012.6521821
https://doi.org/10.1109/iemt.2012.6521821
Publikováno v:
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 based printed circuit boards (PCB) has prompted market demand for HFR-free computer systems. Unfortunately, this transition has been made
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd9f79855ca26c820984ea53c1f0bff1
https://doi.org/10.1109/impact.2010.5699673
https://doi.org/10.1109/impact.2010.5699673
Publikováno v:
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
The electronics industry is aggressively pursuing the removal of potentially toxic compounds from their products, including the halogenated flame retardants (HFRs) that were once widely used in electronics housings and cases and are still used extens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f302cdd995f6552bcb80e08f79fd96ac
https://doi.org/10.1109/impact.2009.5382255
https://doi.org/10.1109/impact.2009.5382255
Publikováno v:
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
The electronics industry is aggressively pursuing the removal of potentially toxic compounds from their products, including the halogenated flame retardants (HFRs) that were once widely used in electronics housings and cases and are still used extens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c73cd1e38579b0ed7df3ae11081a97e0
https://doi.org/10.1109/icept.2009.5270674
https://doi.org/10.1109/icept.2009.5270674
Autor:
Stephen Tisdale, Kostas I. Papathomas, Haley Fu, Roger S. Krabbenhoft, Gary B Long, Terry Fischer
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
Brominated flame retardants, namely polybrominated diphenyl ethers (PBDEs), were one of the main materials used to reduce the flammability of consumer goods and electronics. Growing evidence shows that PBDE compounds are making their way into the env
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b0f549d175ba3d3c86d95057a73585d
https://doi.org/10.1109/iemt.2008.5507787
https://doi.org/10.1109/iemt.2008.5507787
Autor:
Ranjit S. Pandher, Robert Healey, Stephen Tisdale, Polina Snugovsky, Thilo Sack, Keith Howell, Keith Sweatman, Haley Fu, Richard J. Coyle, Gregory Henshall, Fay Hua
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
Recently, the industry has seen an increase in the number of Pb-free solder alloy choices beyond the common neareutectic Sn-Ag-Cu (SAC) alloys. The increasing number of Pb-free alloys provides opportunities to address important issues, such as the po
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0d2ba2f4076b201c31aaf2195426147
https://doi.org/10.1109/iemt.2008.5507794
https://doi.org/10.1109/iemt.2008.5507794