Zobrazeno 1 - 10
of 45
pro vyhledávání: '"Stephen R. Cain"'
Publikováno v:
Encyclopedia of Packaging Materials, Processes, and Mechanics. :i-x
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e8daea768026791275fc73694221cc9
https://doi.org/10.1142/9789811209666_fmatter
https://doi.org/10.1142/9789811209666_fmatter
Autor:
Mikjaniec Travis S, Ke Pan, Jiefeng Xu, Junbo Yang, Seungbae Park, Yangyang Lai, Stephen R. Cain
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
All electronic packages will induce excess heat during usage and heat dissipation methods were developed to remove spare heat from the die in order to improve reliability. Thermal interface materials (TIMs) are one of the key solutions to decrease th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05147fead1f483899587f87e2e009573
https://doi.org/10.1109/ectc32696.2021.00312
https://doi.org/10.1109/ectc32696.2021.00312
Autor:
Avram Bar-Cohen, Jeffrey C Suhling, Andrew A O Tay, Pengli Zhu, Gang Li, C P Wong, Dae Young Jung, Stephen R Cain, William (Bill) T Chen, Bahgat G Sammakia, Muhannad S Bakir, Suresh K Sitaraman, Kuan-Neng Chen, Chuan Seng Tan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d60b89522c3a6015ee16589367c1239
https://doi.org/10.1142/11303
https://doi.org/10.1142/11303
Autor:
Gamal Refai-Ahmed, Vanlai Pham, Jiefeng Xu, Seungbae Park, Scott McCann, Jing Wang, Huayan Wang, Stephen R. Cain
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In this study, an accelerated Electromigration (EM) test was performed. The test vehicle has four types of common interconnect structure. The first one is a classic Ball Grid Array (BGA), short for BGA; the second one is a solder ball with a copper v
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d76a464e458449c358b55b2f55293e2
https://doi.org/10.1109/ectc.2019.00-25
https://doi.org/10.1109/ectc.2019.00-25
Autor:
Scott McCann, Gamal Refai-Ahmed, Huayan Wang, Seungbae Park, Stephen R. Cain, Vanlai Pham, Jiefeng Xu
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In this study, an Electromigration (EM) acceleration test was conducted at 150 oC ambient temperature with 12A current. The solder joint was made of SAC305. Time 0 void evolution was observed by X-ray. A Finite Element Analysis (FEA) based on Atom Fl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee32daf3f8f1f47d7a858712ac5c9432
https://doi.org/10.1109/ectc.2019.00321
https://doi.org/10.1109/ectc.2019.00321
Autor:
James Cash, J.A. Gregor, Jack P. Lombardi, Mark D. Poliks, Preeth Sivakumar, Stephen R. Cain, Michael K. Budinski
Publikováno v:
International Symposium on Microelectronics. 2016:000648-000652
As part of the investigation of accidents in mass transit, air travel in particular, the National Transportation Safety Board (NTSB) retrieves electronic devices from the crash scene. Analysis of flash memory recovered from these devices can provide
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42008f6d860d5e62d3fc1da2fa5d83fd
https://doi.org/10.4071/isom-2016-thp51
https://doi.org/10.4071/isom-2016-thp51
Autor:
Scott McCann, Yuling Niu, Stephen R. Cain, Seungbae Park, Gamal Refai-Ahmed, Jiefeng Xu, Ho Hyung Lee
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In this study, an electromigration (EM) experiment of a ball in a flip chip package with eutectic SnPb solder has been performed. The test vehicles had two types of ball grid array (BGA) interconnects between the traces: one with Cu via and one witho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a4bf3ee1f2684a16dacb0164004f6cc
https://doi.org/10.1109/ectc.2018.00077
https://doi.org/10.1109/ectc.2018.00077
Publikováno v:
Electrochimica Acta. 185:250-258
The open terminal voltage of a lithium ion battery is measured at temperatures ranging from 0 °C to 50 °C in increments of 10 °C. Primary focus is on three states of charge of the battery (full charge, late life, charge depletion). Estimates of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4458fc56418c529bc411eee5ef1d7221
https://doi.org/10.1016/j.electacta.2015.10.117
https://doi.org/10.1016/j.electacta.2015.10.117