Zobrazeno 1 - 10
of 26
pro vyhledávání: '"Stephen L. Buchwalter"'
Autor:
K W Lee, Claudius Feger, Stephen L. Buchwalter, L. J. Matienzo, Michael A. Gaynes, Peter J. Brofman, David L. Questad
Publikováno v:
IBM Journal of Research and Development. 49:663-675
When microelectronic packages fail in accelerated stress testing, it is often because of mechanical stress and/or moisture acting upon interfaces between polymeric adhesives or encapsulants and other package components such as solder interconnects, c
Publikováno v:
Polymer. 38:4439-4443
Heating a dilute solution of polyaniline emeraldine base in 1-methyl-2 pyrrolidinone under nitrogen at elevated temperatures resulted in the reduction of PANI to its leucoemeraldine state. The product was identified by infra-red, ultraviolet-visible,
Autor:
Stephen L. Buchwalter, Laura L. Kosbar
Publikováno v:
Journal of Polymer Science Part A: Polymer Chemistry. 34:249-260
A series of cycloaliphatic diepoxides with cleavable acetal links were synthesized and characterized. These materials were shown to undergo thermosetting reactions with cyclic anhydride in very similar fashion to a commercial cycloaliphatic epoxide,
Publikováno v:
ChemInform. 22
Organic charge-transfer (CT) salts have been of interest for some years, especially since the discovery of the metallic conductivity of the TTF-TCNQ salt. The authors have begun an investigation of the charge-transfer chemistry of viologens and pyrom
Publikováno v:
Macromolecules. 25:4559-4568
Base hydrolysis and acidification of a polyimide film resulted ina surface that resembles the poly(amic acid), which in the polyimide precursor. Thin modification was thoroughly characterized and found to offer an unusual opportunity to control the d
Publikováno v:
Applied Physics B Photophysics and Laser Chemistry. 54:227-230
Poly(tetrafluoroethylene) (PTFE) does not exhibit excimer laser etching behavior at conventional, e.g., single photon absorption, emissions of 193, 248, and 308 nm, due to the lack of polymer/photon interaction. This is not surprising since the elect
Publikováno v:
2008 58th Electronic Components and Technology Conference.
We report here preliminary results on a new Cu-cored flip chip structure combining C4NP (Controlled Collapse Chip Connect New Process) with Cu spheres for high density interconnections. C4NP is a new wafer bumping technology developed by IBM in which
Autor:
Bing Dang, Da-Yuan Shih, John U. Knickerbocker, Stephen L. Buchwalter, Sarah H. Knickerbocker, Chirag S. Patel, Cornelia K. Tsang, John J. Garant, E. Hughlett, Peter A. Gruber, Krystyna W. Semkow, K. Ruhmer
Publikováno v:
2008 58th Electronic Components and Technology Conference.
Controlled collapse chip connection new process (C4NP) is currently used in IBM manufacturing for all 300 mm Pb-free wafer bumping for flip chip packages. In this study, the extendibility of C4NP technology to ultra fine pitch applications has been e
Autor:
M. Ishizuka, Bing Dang, Stephen L. Buchwalter, T. Asaka, T. Kojima, E. Hughlett, K. Ruhmer, Da-Yuan Shih
Publikováno v:
2007 9th Electronics Packaging Technology Conference.
Technology roadmaps for electronic packaging and 3D integration show the continuing trend of increasing input/output connection density between the semiconductor chip and the package or between two different IC's. For FlipChip packaging applications,
Autor:
Kostantinos Papathomas, Sampath Purushothaman, Nancy C. LaBianca, Jeffrey D. Gelorme, Sung Kwon Kang, Stephen L. Buchwalter, Mark D. Poliks
Publikováno v:
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
As mobile computing and telecommunication electronics are spreading fast, a demand for microelectronics packaging schemes for high density, fine pitch, high performance and low cost becomes even more severe. Specifically, the conventional printed cir