Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Stephen C. K. Wong"'
Publikováno v:
Journal of Physics: Conference Series. 34:142-147
In this paper, performance evaluation of miniature heat pipes in LTCC was made by numerical analysis, and the optimum miniature heat pipe design was defined. The effect of the groove depth, width and vapor space on the heat transfer capacity of minia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b29a831dceb9cc461245ee4a5259842
https://doi.org/10.1088/1742-6596/34/1/024
https://doi.org/10.1088/1742-6596/34/1/024
Publikováno v:
Microelectronics Reliability. 44:755-769
This paper describes a thermal design methodology for a 2.5 Gbps optical transmitter that mainly comprises a laser array of 12 VCSELs and a laser driver module. An integrated heat sink design was performed and optimized through modeling and simulatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51744de3a349f55fffb1378e92212bc3
https://doi.org/10.1016/j.microrel.2004.02.002
https://doi.org/10.1016/j.microrel.2004.02.002
Publikováno v:
Semiconductor Science and Technology. 17:911-917
Several commercial electroless nickel chemicals were evaluated with a low cost wafer bumping process. In this paper we describe some physical and electric properties of the nickel bumps built up by these commercial electroless nickel chemicals. Final
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::193ec042233d92f577e3c3eafd2fb4cc
https://doi.org/10.1088/0268-1242/17/9/302
https://doi.org/10.1088/0268-1242/17/9/302
Autor:
Stephen C. K. Wong, Lai Lai Wai, Wei Fan, Albert C. W. Lu, Kim H. Chin, Toshio Yamazaki, Jacinto Jun Jarcia
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
This paper will describe the high-frequency analysis and characterization of embedded resistors fabricated in organic substrates. Although embedded resistors have been widely used in organic substrates, detailed analysis and characterization at high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57fe2eeeac0a2cd701e26ee0f216816e
https://doi.org/10.1115/ipack2005-73345
https://doi.org/10.1115/ipack2005-73345
Autor:
Bill Freeman, Vasudivan Sunappan, Hongjin Jiang, Wei Fan, Stephen C. K. Wong, Y.M. Tan, Kai Meng Chua, Peter Z.F. Shi
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
We proposed a methodology for simulation and design of thermoelectric coolers based on the energy balance among the Peltier heat, Joule heat, conduction heat, radiation heat and convection heat and by using the Computational Fluid Dynamics software.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8328bed994d645f4c7b6974e882f47a6
https://doi.org/10.1115/ipack2005-73309
https://doi.org/10.1115/ipack2005-73309
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971); 2004, p240-243, 4p
Publikováno v:
Twenty-First Annual IEEE Applied Power Electronics Conference & Exposition, 2006 (APEC '06); 2006, p7-7, 1p